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AD9040A Arkusz danych(PDF) 4 Page - Analog Devices |
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AD9040A Arkusz danych(HTML) 4 Page - Analog Devices |
4 / 12 page AD9040A REV. B –4– PIN FUNCTION DESCRIPTIONS Pin No. Name Function 1, 12, 21 –VS 5 V Power Supply 2, 4, 11, 14, 22 GND Ground 3, 10 +VS Analog +5 V Power Supply 5VOUT Internal Bandgap Voltage Reference (Nominally +2.5 V) 6VREF Noninverting Input to Reference Amplifier. Voltage reference for ADC is connected here. 7BPREF External Connection for (0.1 µF) Reference Bypass Capacitor 8 NC No Connection Internally 9 ENCODE Encode Clock Input to ADC. Internal T/H placed in hold mode (ADC is encoding) on rising edge. 13 AIN Noninverting Input to T/H Amplifier 15 OR Out-of-Range Condition Output. Active high when analog input exceeds input range of ADC by 1 LSB (<FS –1 LSB or >+FS + 1 LSB). 16 D9 (MSB) Most Significant Bit of ADC Output; TTL/CMOS Compatible 17–20 D8–D5 Digital Output Bits of ADC; TTL/ CMOS Compatible 23 VD Digital +5 V Power Supply 24–27 D4–D1 Digital Output Bits of ADC; TTL/CMOSL Compatible 28 D0 (LSB) Least Significant Bit of ADC Output; TTL/CMOS Compatible TOP VIEW (Not to Scale) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 AD9040A NC = NO CONNECT GND AIN –VS GND +VS ENCODE NC –VS GND +VS GND BPREF VREF VOUT OR D9 (MSB) D8 D7 D6 D5 –VS D0 (LSB) D1 D2 D3 GND VD D4 PDIP and SOIC Pinouts ENCODE GND +VS VREF VOUT NC BPREF D7 D6 D5 D4 D3 D2 DGND –VS VD DIE LAYOUT AND MECHANICAL INFORMATION Die Dimensions . . . . . . . . . . . . . . . . . 204 × 185 × 21 (±1) mils Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 × 4 mils Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–VS Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5,070 Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride Die Attach (JN/JR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . Epoxy Bond Wire (JN/JR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold N N + 1 #2 #3 ENCODE N – 3 N – 2 N – 1 tA tEH tEL tPD AIN DIGITAL OUTPUTS APERTURE DELAY PULSEWIDTH HIGH PULSEWIDTH LOW OUTPUT PROP DELAY tA tEH tEL tPD 1.9 10ns 10 7.5 100 12 MIN TYP MAX 10 100 Figure 1. Timing Diagram |
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