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OP176GP Arkusz danych(PDF) 3 Page - Analog Devices |
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OP176GP Arkusz danych(HTML) 3 Page - Analog Devices |
3 / 21 page OP176 REV. 0 –3– ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±22 V Input Voltage 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Differential Input Voltage 2 . . . . . . . . . . . . . . . . . . . . . . . ±7.5 V Output Short-Circuit Duration to GND . . . . . . . . . . Indefinite Storage Temperature Range P, S Package . . . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Operating Temperature Range OP176G . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Junction Temperature Range P, S Package . . . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300 °C Package Type θ JA 3 θ JC Units 8-Pin Plastic DIP (P) 103 43 °C/W 8-Pin SOIC (S) 158 43 °C/W NOTES 1Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. 2For input voltages greater than ±7.5 V limit input current to less than 5 mA. 3 θ JA is specified for the worst case conditions, i.e., θJA is specified for device in socket for P-DIP packages; θ JA is specified for device soldered in circuit board for SOIC package. (@ V S = ± 15.0 V, TA = +25°C unless otherwise noted) WARNING! ESD SENSITIVE DEVICE CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the OP176 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Parameter Symbol Conditions Limit Units Offset Voltage V OS 1 mV max Input Bias Current I B V CM = 0 V 350 nA max Input Offset Current I OS V CM = 0 V ±50 nA max Input Voltage Range 1 V CM ±10.5 V min Common-Mode Rejection CMRR V CM = ± 10.5 V 80 dB min Power Supply Rejection Ratio PSRR V = ±4.5 V to ±18 V 86 dB min Large Signal Voltage Gain A VO R L = 2 kΩ 250 V/mV min Output Voltage Range V O R L = 2 kΩ 13.5 V min V S = ± 18.0 V, RL = 600 Ω 14.8 V min Supply Current I SY V S = ± 22.0 V, VO = 0 V, RL = ∞ 2.75 mA max V S = ± 4.5 V to ± 18 V, 2.5 mA max V O = 0 V, RL = ∞ NOTES Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing. 1Guaranteed by CMR test. OP176 Die Size 0.069 × 0.067 Inch, 4,623 Sq. Mils. Substrate (Die Backside) Is Connected to V–. Transistor Count, 26. WAFER TEST LIMITS NULL V+ OUT NULL –IN +IN V– DICE CHARACTERISTICS ORDERING GUIDE Model Temperature Range Package Description Package Option OP176GP –40 °C to +85°C 8-Pin Plastic DIP N-8 OP176GS –40 °C to +85°C 8-Pin SOIC SO-8 OP176GSR –40 °C to +85°C SO-8 Reel, 2500 Pieces OP176GBC +25 °C DICE |
Podobny numer części - OP176GP |
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Podobny opis - OP176GP |
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