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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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Qxx12RH5 Arkusz danych(PDF) 5 Page - Littelfuse |
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Qxx12RH5 Arkusz danych(HTML) 5 Page - Littelfuse |
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5 / 8 page  103 Revised: November 1, 2010 05:04 PM ©2010 Littelfuse, Inc Teccor® brand Thyristors Specifications are subject to change without notice. Please refer to http://www.littelfuse.com for current information. 12 Amp Alternistor (High Communitation) Triacs Qxx12xHx Series Soldering Parameters Reflow Condition Pb – Free assembly Pre Heat -Temperature Min (T s(min)) 150°C -Temperature Max (T s(max)) 200°C -Time (min to max) (t s) 60 – 180 secs Average ramp up rate (LiquidusTemp) (T L) to peak 5°C/second max T S(max) to TL - Ramp-up Rate 5°C/second max Reflow -Temperature (T L) (Liquidus) 217°C -Time (min to max) (t s) 60 – 150 seconds PeakTemperature (T P) 260+0/5°C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peakTemperature (T P) 8 minutes Max. Do not exceed 280°C Environmental Specifications Test Specifications and Conditions AC Blocking MIL-STD-750, M-1040, Cond A Applied Peak AC voltage @ 125°C for 1008 hours Temperature Cycling MIL-STD-750, M-1051, 100 cycles; -40°C to +150°C; 15-min dwell time Temperature/ Humidity EIA / JEDEC, JESD22-A101 1008 hours; 320V - DC: 85°C; 85% rel humidity High Temp Storage MIL-STD-750, M-1031, 1008 hours; 150°C Low-Temp Storage 1008 hours; -40°C Thermal Shock MIL-STD-750, M-1056 10 cycles; 0°C to 100°C; 5-min dwell time at each temperature; 10 sec (max) transfer time between temperature Autoclave EIA / JEDEC, JESD22-A102 168 hours (121°C at 2 ATMs) and 100% R/H Resistance to Solder Heat MIL-STD-750 Method 2031 Solderability ANSI/J-STD-002, category 3, Test A Lead Bend MIL-STD-750, M-2036 Cond E Physical Specifications Terminal Finish 100% Matte Tin-plated Body Material UL recognized epoxy meeting flammability classification 94V-0 Terminal Material Copper Alloy Design Considerations Careful selection of the correct device for the application’s operating parameters and environment will go a long way toward extending the operating life of the Thyristor. Good design practice should limit the maximum continuous current through the main terminals to 75% of the device rating. Other ways to ensure long life for a power discrete semiconductor are proper heat sinking and selection of voltage ratings for worst case conditions. Overheating, overvoltage (including dv/dt), and surge currents are the main killers of semiconductors. Correct mounting, soldering, and forming of the leads also help protect against component damage. Time TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature Preheat Preheat Ramp-up Ramp-up Ramp-down Ramp-do |
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