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Zakładka z wyszukiwarką danych komponentów |
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Zakładka z wyszukiwarką danych komponentów |
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FDC645 Arkusz danych(PDF) 2 Page - Fairchild Semiconductor |
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FDC645 Arkusz danych(HTML) 2 Page - Fairchild Semiconductor |
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2 / 8 page  FDC645N Rev B(W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = 250 µA 30 V ∆BVDSS ===∆TJ Breakdown Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C 22 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V 1 µA IGSSF Gate–Body Leakage, Forward VGS = 12 V, VDS = 0 V 100 nA IGSSR Gate–Body Leakage, Reverse VGS = –12 V, VDS = 0 V –100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 0.8 1.4 2 V ∆VGS(th) ===∆TJ Gate Threshold Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C – 4 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = 4.5 V, ID = 5.5 A VGS = 10 V, ID = 6.2 A VGS = 4.5 V, ID = 5.5 A, TJ =125 °C 25 23 34 30 26 48 m Ω ID(on) On–State Drain Current VGS = 4.5 V, VDS = 5 V 20 A gFS Forward Transconductance VDS = 10 V, ID = 5.5 A 33 S Dynamic Characteristics Ciss Input Capacitance 1460 pF Coss Output Capacitance 227 pF Crss Reverse Transfer Capacitance VDS = 15 V, V GS = 0 V, f = 1.0 MHz 96 pF Switching Characteristics (Note 2) td(on) Turn–On Delay Time 8 16 ns tr Turn–On Rise Time 9 18 ns td(off) Turn–Off Delay Time 35 56 ns tf Turn–Off Fall Time VDS = 15 V, ID = 1 A, VGS = 4.5 V, RGEN = 6 Ω 714 ns Qg Total Gate Charge 13 21 nC Qgs Gate–Source Charge 3.6 nC Qgd Gate–Drain Charge VDS = 15 V, ID = 6.2 A, VGS = 4.5 V 3.6 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current 1.3 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = 1.3 A (Note 2) 0.7 1.2 V Notes: 1. R θJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θJC is guaranteed by design while RθCA is determined by the user's board design. a. 78°C/W when mounted on a 1in 2 pad of 2oz copper on FR-4 board. b. 156°C/W when mounted on a minimum pad. 2. Pulse Test: Pulse Width ≤=300 µs, Duty Cycle ≤=2.0% |
Podobny numer części - FDC645 |
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Podobny opis - FDC645 |
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