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FDD2612 Arkusz danych(PDF) 4 Page - Fairchild Semiconductor |
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FDD2612 Arkusz danych(HTML) 4 Page - Fairchild Semiconductor |
4 / 5 page FDD2612 Rev B1(W) Typical Characteristics 0 3 6 9 12 15 024 68 10 Q g, GATE CHARGE (nC) I D = 1.5A V DS = 50V 150V 100V 0 50 100 150 200 250 300 350 0 40 80 120 160 200 V DS, DRAIN TO SOURCE VOLTAGE (V) CISS C RSS COSS f = 1MHz VGS = 0 V Figure 7. Gate Charge Characteristics. Figure 8. Capacitance Characteristics. 0.001 0.01 0.1 1 10 100 0.1 1 10 100 1000 VDS, DRAIN-SOURCE VOLTAGE (V) DC 1s 100ms RDS(ON) LIMIT V GS = 10V SINGLE PULSE RθJA = 96 oC/W TA = 25 oC 10ms 1ms 100µs 10s 0 20 40 60 80 100 0.01 0.1 1 10 100 1000 t1, TIME (sec) SINGLE PULSE RθJA =96°C/W TA = 25°C Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum Power Dissipation. 0.001 0.01 0.1 1 0.0001 0.001 0.01 0.1 1 10 100 1000 RθJA(t) = r(t) + RθJA RθJA = 96 °C/W TJ - TA = P * RθJA(t) Duty Cycle, D = t1 / t2 P(pk) t1 t2 SINGLE PULSE 0.01 0.02 0.05 0.1 0.2 D = 0.5 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. |
Podobny numer części - FDD2612 |
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Podobny opis - FDD2612 |
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