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ADM1232ANZ1 Arkusz danych(PDF) 4 Page - Analog Devices |
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ADM1232ANZ1 Arkusz danych(HTML) 4 Page - Analog Devices |
4 / 12 page ADM1232 Rev. C | Page 4 of 12 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE TA = 25°C unless otherwise noted. Table 2. Parameter Rating VCC 5.5 V Logic Inputs −0.3 V to VCC + 0.3 V Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 10 sec) 300°C Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C Power Dissipation N-81 1000 mW RW-16, RM-82 900 mW R-82 900 μW θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance Package Type θJA Unit 8-Lead PDIP (N-8) 100 °C/W 16-Lead SOIC_W (RW-16) 73 °C/W 8-Lead MSOP (RM-8) 206 °C/W 8-Lead SOIC_N (R-8) 153 °C/W ESD CAUTION 1 Derate by 13.5 mW/°C above 25°C. 2 Derate by 12 mW/°C above 25°C. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
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