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PZT2907AT1G Arkusz danych(PDF) 1 Page - ON Semiconductor

Numer części PZT2907AT1G
Szczegółowy opis  PNP Silicon Epitaxial Transistor
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Producent  ONSEMI [ON Semiconductor]
Strona internetowa  http://www.onsemi.com
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 Semiconductor Components Industries, LLC, 2011
November, 2011 − Rev. 9
1
Publication Order Number:
PZT2907AT1/D
PZT2907AT1,
SPZT2907AT1G
Preferred Device
PNP Silicon
Epitaxial Transistor
This PNP Silicon Epitaxial transistor is designed for use in linear
and switching applications. The device is housed in the SOT-223
package which is designed for medium power surface mount
applications.
Features
NPN Complement is PZT2222AT1
The SOT-223 package can be soldered using wave or reflow
SOT-223 package ensures level mounting, resulting in improved
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering eliminating
the possibility of damage to the die.
AEC−Q101 Qualified and PPAP Capable
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector−Emitter Voltage
VCEO
−60
Vdc
Collector−Base Voltage
VCBO
−60
Vdc
Emitter−Base Voltage
VEBO
−5.0
Vdc
Collector Current − Continuous
IC
−600
mAdc
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation (Note 1)
TA = 25C
PD
1.5
12
W
mW/C
Thermal Resistance Junction−to−Ambient
(Note 1)
RqJA
83.3
C/W
Lead Temperature for Soldering,
0.0625 from case
Time in Solder Bath
TL
260
10
C
Sec
Operating and Storage Temperature Range
TJ, Tstg
−65 to
+150
C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 with 1 oz and 713 mm2 of copper area.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use
and best overall value.
SOT−223
CASE 318E
STYLE 1
MARKING DIAGRAM
COLLECTOR
2, 4
1
BASE
3
EMITTER
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Device
Package
Shipping
ORDERING INFORMATION
PZT2907AT1
SOT−223 1,000 / Tape & Reel
PZT2907AT1G
SOT−223
(Pb−Free)
1,000 / Tape & Reel
PZT2907AT3
SOT−223 4,000 / Tape & Reel
1
AYW
P2F G
G
P2F
= Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
http://onsemi.com
(Note: Microdot may be in either location)
PZT2907AT3G
SOT−223
(Pb−Free)
4,000 / Tape & Reel
SPZT2907AT1G
SOT−223
(Pb−Free)
1,000 / Tape & Reel


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