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DAC08CS Arkusz danych(PDF) 2 Page - Analog Devices |
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DAC08CS Arkusz danych(HTML) 2 Page - Analog Devices |
2 / 20 page DAC08 Rev. C | Page 2 of 20 TABLE OF CONTENTS Specifications..................................................................................... 3 Electrical Characteristics............................................................. 3 Typical Electrical Characteristics ............................................... 4 Absolute Maximum Ratings............................................................ 5 ESD Caution.................................................................................. 5 Pin Connections ............................................................................... 6 Test and Burn-In Circuits................................................................ 7 Typical Performance Characteristics ............................................. 8 Basic Connections .......................................................................... 11 Application Information................................................................ 13 Reference Amplifier Setup ........................................................ 13 Reference Amplifier Compensation for Multiplying Applications ................................................................................ 13 Logic Inputs................................................................................. 13 Analog Output Currents ........................................................... 14 Power Supplies ............................................................................ 14 Temperature Performance......................................................... 14 Multiplying Operation............................................................... 14 Settling Time............................................................................... 14 ADI Current Output DACs........................................................... 16 Outline Dimensions ....................................................................... 17 Ordering Guide .......................................................................... 18 REVISION HISTORY 11/04—Rev. B to Rev. C Changed SO to SOIC .........................................................Universal Removed DIE ......................................................................Universal Changes to Figure 30, Figure 31, Figure 32................................. 12 Change to Figure 33 ....................................................................... 15 Added Table 4.................................................................................. 16 Updated Outline Dimensions ....................................................... 17 Changes to Ordering Guide .......................................................... 18 2/02—Rev. A to Rev. B Edits to SPECIFICATIONS............................................................. 2 Edits to ABSOLUTE MAXIMUM RATING ................................ 3 Edits to ORDERING GUIDE.......................................................... 3 Edits to WAFER TEST LIMITS ...................................................... 5 Edit to Figure 13 ............................................................................... 8 Edits to Figures 14 and 15 ............................................................... 9 |
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