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BCP53-16T3G Arkusz danych(PDF) 5 Page - ON Semiconductor

Numer części BCP53-16T3G
Szczegółowy opis  PNP Silicon Epitaxial Transistors
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2N7002E
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5
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
mm
inches
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
SOLDERING FOOTPRINT
VIEW C
L
0.25
L1
q
e
E
E
b
A
SEE VIEW C
DIM
A
MIN
NOM
MAX
MIN
MILLIMETERS
0.89
1.00
1.11
0.035
INCHES
A1
0.01
0.06
0.10
0.001
b
0.37
0.44
0.50
0.015
c
0.09
0.13
0.18
0.003
D
2.80
2.90
3.04
0.110
E
1.20
1.30
1.40
0.047
e
1.78
1.90
2.04
0.070
L
0.10
0.20
0.30
0.004
0.040
0.044
0.002
0.004
0.018
0.020
0.005
0.007
0.114
0.120
0.051
0.055
0.075
0.081
0.008
0.012
NOM
MAX
L1
H
2.10
2.40
2.64
0.083
0.094
0.104
HE
0.35
0.54
0.69
0.014
0.021
0.029
c
0
−−−
10
0
−−−
10
q
°
°
°
°
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