MC06XSD200FK datasheet(6/60 Pages) FREESCALE

Numer części	MC06XSD200FK

Szczegółowy opis	Dual 6.0 mOhm High Side Switch

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Producent	FREESCALE [Freescale Semiconductor, Inc]

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Analog Integrated Circuit Device Data



6

Freescale Semiconductor

06XSD200

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are relative to ground unless mentioned otherwise. Exceeding these ratings may cause permanent damage.

Parameter

Symbol

Maximum ratings

Unit

ELECTRICAL RATINGS

VPWR Supply Voltage Range

Voltage Transient at 25 °C (500 ms)

Reverse Voltage at 25 °C

Fast Negative Transient Pulses (ISO 7637-2 pulse #1, VPWR=14V & Ri=10)

VPWR

58

-28

-60

V

VDD Supply Voltage Range

VDD

-0.3 to 5.5

V

Voltage on Input pins(1) (except IN[0:1]) and Output pins(2)(except HS[0:1])

VMAX,LOGIC(1)

-0.3 to 5.5

V

Voltage on Fail-safe Output (FSOB)

VFSO

-0.3 to 58

V

Voltage on SO pin

VSO

-0.3 to VDD+0.3

V

Voltage (continuous, max. allowable) on IN[0:1] Inputs

VIN,MAX

58

V

Voltage (continuous, max. allowable) on output pins (HS [0:1]),

VHS[0:1]

-28 to 58

V

Rated Continuous Output Current per channel(3)

IHS[0:1]

9.0

A

Maximum allowable energy dissipation per channel and two parallel channels,

single-pulse method(4)

ECL[0:1]_SING

480

mJ

Maximum allowable energy dissipation per channel and two parallel channels,

repetitive-pulses condition. 1(5)

ECL[0:1]_REP1

350

mJ

Maximum allowable energy dissipation per channel and two parallel channels,

repetitive-pulses condition. 2(6)

ECL[0:1]_REP2

350

mJ

ESD Voltage(7)

Human Body Model (HBM) for HS[0:1], VPWR and GND

Human Body Model (HBM) for other pins

Charge Device Model (CDM)

Package Corner pins (1, 13, 19, 20)

All Other pins

VESD1

VESD2

VESD3

VESD4

±8000

±2000

±750

±500

V

Notes:

1.

Concerned Input pins are: CONF[0:1], RSTB, SI, SCLK, Clock, and CSB.

2.

Concerned Output pins are: CSNS, SYNC, and FSB.

3.

Output current rating valid as long as maximum junction temperature is not exceeded. For computation of the maximum allowable output

current, the thermal resistance of the package & the underlying heatsink must be taken into account

4.

Single pulse Energy dissipation, Single-pulse short-circuit method (LL = 2.0 mH, R = 30 mVPWR = 28 V, TJ = 150 C initial).

5.

Dissipation during repetitive cycles: switch off upon short-circuit (LL = 20 µH, R = 200 mVPWR = 28 V, TJ = 125 C initial, fS<2.0 Hz).

6.

Dissipation during repetitive cycles: switch off upon short-circuit (LL = 40 µH, R = 400 mVPWR = 28 V, TJ = 125 C initial, fS<2.0 Hz).

7.

ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 ), and the Charge Device

Model (CDM), Robotic (CZAP = 4.0 pF).

Podobny numer części - MC06XSD200FK

Producent	Numer części	Arkusz danych	Szczegółowy opis
NXP Semiconductors	MC06XSD200FK	3Mb / 59P	Dual 6.0 mOhm High Side Switch Rev. 3.0, 12/2013

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Podobny opis - MC06XSD200FK

Producent	Numer części	Arkusz danych	Szczegółowy opis
NXP Semiconductors	MC06XSD200	3Mb / 59P	Dual 6.0 mOhm High Side Switch Rev. 3.0, 12/2013
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