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AD532JDZ Arkusz danych(PDF) 6 Page - Analog Devices

Numer części AD532JDZ
Szczegółowy opis  Internally Trimmed Integrated Circuit Multiplier
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AD532JDZ Arkusz danych(HTML) 6 Page - Analog Devices

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AD532
Rev. D | Page 5 of 16
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 2. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
H-10A
150
25
°C/W
E-20A
85
22
°C/W
D-14
85
22
°C/W
CHIP DIMENSIONS AND BONDING DIAGRAM
Contact factory for latest dimensions.
Dimensions are shown in inches and (mm).
0.062
(1.575)
GND
Z
0.107
(2.718)
–VS
+VS
Y1
Y2
X2
X1
VOS
OUTPUT
Figure 2.
ESD CAUTION


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