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TLP708F Arkusz danych(PDF) 9 Page - Toshiba Semiconductor |
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TLP708F Arkusz danych(HTML) 9 Page - Toshiba Semiconductor |
9 / 13 page TLP708,TLP708F 2012-08-07 9 (2) Precautions for General Storage 1) Do not store devices in places where they will be exposed to moisture or direct sunlight. 2) During transportation or storage of devices, follow the cautions indicated on the carton box. 3) The storage area temperature should be kept within a temperature range of 5 ˚C to 35 ˚C, and the relative humidity should be maintained between 45% and 75%. 4) Do not store devices in the presence of harmful (especially corrosive) gases, or under dusty conditions. 5) Use storage areas where there is minimal temperature fluctuation. The solderability of the leads will be degraded as rapid temperature changes can cause condensation to form on the stored devices, resulting in lead oxidation or corrosion. 6) When repacking devices, use anti-static containers. 7) Do not apply any external force or load directly to devices when they are in storage. 8) If devices have been stored for more than two years, it is recommended that their solderability be tested before they are used even if the above precautions have been followed. |
Podobny numer części - TLP708F |
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Podobny opis - TLP708F |
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