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TLP708F Arkusz danych(PDF) 10 Page - Toshiba Semiconductor |
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TLP708F Arkusz danych(HTML) 10 Page - Toshiba Semiconductor |
10 / 13 page TLP708,TLP708F 2012-08-07 10 Specifications for Embossed-Tape Packing (TP) for SDIP6 Type Photocoupler 1. Applicable Package Package Name Product Type SDIP6 Photocouplers 2. Product Naming System Type of package used for shipment is denoted by a symbol suffix after a product number. The method of classification is as below. (Example) TLP708 (TP, F) [[G]]/RoHS COMPATIBLE (Note 6) Tape type Device name 3. Tape Dimensions 3.1 Orientation of Devices in Relation to Direction of Tape Movement Device orientation in the recesses is as shown in Figure 1. Figure 1 Device Orientation 3.2 Tape Packing Quantity: 1500 devices per reel 3.3 Empty Device Recesses Are as Shown in Table 1. Table 1 Empty Device Recesses Item Standard Remarks Occurrences of 2 or more successive empty device recesses 0 Within any given 40-mm section of tape, not including leader and trailer Single empty device recesses 6 devices (max) per reel Not including leader and trailer 3.4 Start and End of Tape: The start of the tape has 30 or more empty holes. The end of the tape has 30 or more empty holes and two empty turns as a cover tape. Tape feed |
Podobny numer części - TLP708F |
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Podobny opis - TLP708F |
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