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AD8005AR Arkusz danych(PDF) 4 Page - Analog Devices

Numer części AD8005AR
Szczegółowy opis  270 MHz, 400 mA Current Feedback Amplifier
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Producent  AD [Analog Devices]
Strona internetowa  http://www.analog.com
Logo AD - Analog Devices

AD8005AR Arkusz danych(HTML) 4 Page - Analog Devices

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AD8005
–4–
REV. A
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Internal Power Dissipation
2
Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . 1.3 Watts
Small Outline Package (R) . . . . . . . . . . . . . . . . . . 0.75 Watts
SOT-23-5 Package (RT) . . . . . . . . . . . . . . . . . . . 0.5 Watts
Input Voltage (Common Mode) . . . . . . . . . . . . . . .
±V
S ± 1V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .
±3.5 V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range
N, R & RT Package . . . . . . . . . . . . . . . . . –65
°C to +125°C
Operating Temperature Range (A Grade) . . . –40
°C to +85°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device in free air:
8-Lead Plastic DIP Package:
θ
JA = 90°C/W
8-Lead SOIC Package:
θ
JA = 155°C/W
5-Lead SOT-23 Package:
θ
JA = 240°C/W
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8005 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8005 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic
encapsulated devices is determined by the glass transition tem-
perature of the plastic, approximately +150
°C. Exceeding this
limit temporarily may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of +175
°C for an extended
period can result in device failure.
While the AD8005 is internally short circuit protected, this may
not be sufficient to guarantee that the maximum junction tem-
perature (+150
°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves shown in Figure 3.
AMBIENT TEMPERATURE – °C
90
80
2.0
1.0
0
1.5
0.5
8-LEAD PLASTIC-DIP PACKAGE
–50
TJ = +150°C
70
60
50
40
30
20
10
0
–40 –30 –20 –10
8-LEAD SOIC PACKAGE
5-LEAD SOT-23 PACKAGE
Figure 3. Maximum Power Dissipation vs. Temperature
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Temperature
Package
Package
Brand
Model
Range
Description
Option
Code
AD8005AN
–40
°C to +85°C
8-Lead Plastic DIP
N-8
AD8005AR
–40
°C to +85°C
8-Lead Plastic SOIC
SO-8
AD8005AR-REEL
–40
°C to +85°C
13" Tape and Reel
SO-8
AD8005ART-REEL
–40
°C to +85°C
13" Tape and Reel
RT-5
H1A
AD8005AR-REEL7
–40
°C to +85°C
7" Tape and Reel
SO-8
AD8005ART-REEL7
–40
°C to +85°C
7" Tape and Reel
RT-5
H1A


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