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ADV7622BSTZ Arkusz danych(PDF) 8 Page - Analog Devices |
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ADV7622BSTZ Arkusz danych(HTML) 8 Page - Analog Devices |
8 / 16 page ADV7622 Data Sheet Rev. D | Page 8 of 16 ABSOLUTE MAXIMUM RATINGS Table 4. Parameter Rating CVDD to GND 2.2 V DVDD to GND 2.2 V PVDD to GND 2.2 V DVDDIO to GND 4.0 V TVDD to GND 4.0 V TXAVDD to GND 2.2 V TXPVDD to GND 2.2 V TXPLVDD to GND 2.2 V Digital Inputs Voltage to GND GND − 0.3 V to DVDDIO + 0.3 V up to a maximum of 4.0 V 5 V Tolerant Digital Inputs to GND1 5.5 V Digital Output Voltage to GND GND − 0.3 V to DVDDIO + 0.3 V up to a maximum of 4.0 V XTAL, XTAL1 Pins −0.3 V to PVDD to +0.3 V Maximum Junction Temperature (TJ MAX) 125°C Storage Temperature 150°C Infrared Reflow, Soldering (20 sec) 260°C 1 The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL, DDCA_SDA, DDCB_SCL, DDCB_SDA, DDCC_SCL, DDCC_SDA, DDCD_SCL, DDCD_SDA, TXDDC_SDA, TXDDC_SCL, HP_CTRLA, HP_CTRLB, HP_CTRLC, HP_CTRLD, HPD_ARC−, 5V_DETA, 5V_DETB, 5V_DETC, 5V_DETD, PWRDN, CEC, ARC+. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL PERFORMANCE To reduce power consumption when using the ADV7622, turn off the unused sections of the part. Due to printed circuit board (PCB) metal variation and, thus, variation in PCB heat conductivity, the value of θJA may differ for various PCBs. The most efficient measurement solution is obtained using the package surface temperature to estimate the die temperature because this eliminates the variance associated with the θJA value. The maximum junction temperature (TJ MAX) of 125°C must not be exceeded. The following equation calculates the junction temperature using the measured package surface temperature and applies only when no heat sink is used on the DUT: TJ = TS + (ΨJT × WTOTAL) where: TS = the package surface temperature (°C). ΨJT = 0.6°C/W for a 144-ball LQFP. WTOTAL = ((CVDD × ICVDD) + (DVDD × IDVDD) + (PVDD × IPVDD) + (DVDDIO × IDVDDIO) + (0.7 × TVDD × ITVDD) + (TXAVDD × ITXAVDD) + (TXPVDD × ITXPVDD) + (TXPLVDD × ITXPLVDD)) Note that for WTOTAL, 5% of TVDD power is dissipated on the part itself. ESD CAUTION |
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