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ADMP504ACEZ Arkusz danych(PDF) 9 Page - Analog Devices |
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ADMP504ACEZ Arkusz danych(HTML) 9 Page - Analog Devices |
9 / 12 page Data Sheet ADMP504 Rev. 0 | Page 9 of 12 PCB LAND PATTERN LAYOUT The recommended PCB land pattern for the ADMP504 should be laid out to a 1:1 ratio to the solder pads on the microphone package, as shown in Figure 10. Take care to avoid applying solder paste to the sound hole in the PCB. A suggested solder paste stencil pattern layout is shown in Figure 11. The diameter of the sound hole in the PCB should be larger than the diameter of the sound port of the microphone. A minimum diameter of 0.5 mm is recommended. Ø1.55 Ø0.95 1.52 0.90 1.90 1.22 0.68 0.61 0.61 Figure 10. PCB Land Pattern Layout 1.22 2× 0.8 × 0.6 0.2 × 45° TYP 1.52mm 1.55/1.05 DIA. 0.225 CUT WIDTH (2×) Figure 11. Suggested Solder Paste Stencil Pattern Layout |
Podobny numer części - ADMP504ACEZ |
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Podobny opis - ADMP504ACEZ |
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