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PZT2222AT1 Arkusz danych(PDF) 4 Page - Motorola, Inc |
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PZT2222AT1 Arkusz danych(HTML) 4 Page - Motorola, Inc |
4 / 6 page PZT2222AT1 4 Motorola Small–Signal Transistors, FETs and Diodes Device Data INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. SOT-223 0.079 2.0 0.15 3.8 0.248 6.3 0.079 2.0 0.059 1.5 0.059 1.5 0.059 1.5 0.091 2.3 0.091 2.3 mm inches SOT-223 POWER DISSIPATION The power dissipation of the SOT-223 is a function of the pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, R θJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA. Using the values provided on the data sheet for the SOT-223 package, PD can be calculated as follows: PD = TJ(max) – TA R θJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 1.5 watts. PD = 150 °C – 25°C = 1.5 watts 83.3 °C/W The 83.3 °C/W for the SOT-223 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 1.5 watts. There are other alternatives to achieving higher power dissipation from the SOT-223 package. One is to increase the area of the collector pad. By increasing the area of the collector pad, the power dissipation can be increased. Although the power dissipation can almost be doubled with this method, area is taken up on the printed circuit board which can defeat the purpose of using surface mount technology. A graph of R θJA versus collector pad area is shown in Figure 3. 0.8 Watts 1.25 Watts* 1.5 Watts ° A, Area (square inches) 0.0 0.2 0.4 0.6 0.8 1.0 160 140 120 100 80 Figure 3. Thermal Resistance versus Collector Pad Area for the SOT-223 Package (Typical) Board Material = 0.0625 ″ G-10/FR-4, 2 oz Copper TA = 25°C *Mounted on the DPAK footprint Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad ™. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. |
Podobny numer części - PZT2222AT1 |
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Podobny opis - PZT2222AT1 |
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