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LM1117-2.5L3-0-T3-G Arkusz danych(PDF) 8 Page - Cystech Electonics Corp. |
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LM1117-2.5L3-0-T3-G Arkusz danych(HTML) 8 Page - Cystech Electonics Corp. |
8 / 8 page CYStech Electronics Corp. Spec. No. : C506L3 Issued Date : 2003.03.22 Revised Date :2013.06.19 Page No. : 8/8 LM1117L3 series CYStek Product Specification SOT-223 Dimension *: Typical Inches Millimeters 3 2 1 F B A C D E G H a1 a2 I Marking: Vout: 1.5V→-15 1.8V→-18 2.5V→-25 3.3V→-33 5.0V→-50 Device Name Date Code : (from left to right) 1117 □□□ □□□□ 1st code : year code, 1→2011, 2→2012, …,etc. 2nd code : month code, referring to the following table 3rd and 4th codes : production lot serial number , 01, 02, 03, … etc Style: Pin 1.Adj/Gnd 2.Output 3.Input 3-Lead SOT-223 Plastic Surface Mounted Package CYStek Package Code: L3 ADJ→blank Month code : Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code A B C D E F G H J K L M Inches Millimeters DIM Min. Max. Min. Max. DIM Min. Max. Min. Max. A 0.1142 0.1220 2.90 3.10 G 0.0551 0.0709 1.40 1.80 B 0.2638 0.2874 6.70 7.30 H 0.0098 0.0138 0.25 0.35 C 0.1299 0.1457 3.30 3.70 I 0.0008 0.0039 0.02 0.10 D 0.0236 0.0315 0.60 0.80 a1 *13o - *13o - E *0.0906 - *2.30 - a2 0 o 10 o 0 o 10 o F 0.2480 0.2638 6.30 6.70 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. |
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