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3 / 3 page 76 ICs 1-1-4 Linear Regulator ICs ■Reference Data •A higher heat radiation effect can be achieved by enlarging the copper laminate area connected to the inner frame to which a monolithic ICs is mounted. • Obtaining the junction temperature Measure the case temperature TC with a thermocouple, etc. Then, substitute this value in the following formula to obtain the junction temperature. Tj=PD × θj–C + TC ( θj–C = 3°C/W) PD= (VIN–VO)•IOUT Copper Laminate Area (on Glass-Epoxy Board) vs. Thermal Resistance (from Junction to Ambient Temperature) (Typical Value) 55 50 45 40 35 30 0 200 400 600 800 1000 Copper Laminate Area (mm2) 1200 1400 1600 1800 When Using Glass-Epoxy Board of 40 × 40 mm ■Block Diagram ●SI-3010KD/SI-3012KD ●SI-3033KD/SI-3050KD 2 VIN 1 REF VC VO ADJ GND 5 3 4 TSD - + 2 VIN 1 REF VC Vo Sense GND 5 3 4 TSD - + ■Typical Connection Diagram ●SI-3033KD/SI-3050KD ●SI-3010KD/SI-3012KD GND 3 VIN CIN 2 VO CO 4 VC 1 sense 5 + + D1*2 *1 Load GND 3 VIN CIN R1 R2 2 VO 4 VC 1 ADJ 5 + D1*2 CO + *1 R3 *3 Load CIN:Input capacitor (22 µF or larger) CO: Output capacitor *1: SI-3012KD/3033KD (22 µF or larger) Co has to be a low ESR capacitor such as a ceramic capacitor. When using the electrolytic capacitor, oscillation may occur at a low temperature. SI-3010KD/3050KD/ (47 µF or larger) If a low ESR capacitor is used, oscillation may occur. *2: D1: Reverse bias protection diode This diode is required for protection against reverse biasing between the input and output. (Sanken SJPL-H2 is recommended.) This diode is not required at VO ≤ 3.3V. R1, R2: Output voltage setting resistors The output voltage can be set by connecting R1 and R2 as shown above. The recommended value for R2 is 10Ω (24kΩ for SI-3012KD). R1=(VO–VADJ)÷(VADJ/R2) *3: For SI-3010KD, insert R3 in case of setting VO to VO ≤ 1.5V. The recommended value for R3 is 10kΩ. |
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