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XX1001-BD Arkusz danych(PDF) 4 Page - M/A-COM Technology Solutions, Inc.

Numer części XX1001-BD
Szczegółowy opis  Doubler and Power Amplifier
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Producent  MA-COM [M/A-COM Technology Solutions, Inc.]
Strona internetowa  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

XX1001-BD Arkusz danych(HTML) 4 Page - M/A-COM Technology Solutions, Inc.

  XX1001-BD_15 Datasheet HTML 1Page - M/A-COM Technology Solutions, Inc. XX1001-BD_15 Datasheet HTML 2Page - M/A-COM Technology Solutions, Inc. XX1001-BD_15 Datasheet HTML 3Page - M/A-COM Technology Solutions, Inc. XX1001-BD_15 Datasheet HTML 4Page - M/A-COM Technology Solutions, Inc. XX1001-BD_15 Datasheet HTML 5Page - M/A-COM Technology Solutions, Inc. XX1001-BD_15 Datasheet HTML 6Page - M/A-COM Technology Solutions, Inc. XX1001-BD_15 Datasheet HTML 7Page - M/A-COM Technology Solutions, Inc.  
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• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
4
Doubler and Power Amplifier
18.0-21.0/36.0-42.0 GHz
XX1001-BD
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Rev. V1
Mechanical Drawing
(Note: Engineering designator is20DBL0629)
Units:millimeters(inches) Bond pad dimensionsare shown to center of bond pad.
Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside isground,Bond Pad/Backside Metallization:Gold
All DCBond Padsare 0.100 x 0.100 (0.004 x 0.004).All RFBond Padsare 0.100 x 0.200 (0.004 x 0.008)
Bond pad centersare approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:3.987 mg.
Bond Pad #1 (RFIn)
Bond Pad #2 (Vg2)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vd3)
Bond Pad #5 (Vd4)
Bond Pad #6 (Vd5)
Bond Pad #7 (Vd6)
Bond Pad #8 (RFOut)
Bond Pad #9 (Vg6)
Bond Pad #10 (Vg5)
Bond Pad #11 Vg4)
Bond Pad #12 (Vg3)
Bond Pad #13 (Vd1)
Bond Pad #14 (Vg1)
1.700
(0.067)
1
2
3
4
5
6
7
8
9
10
11
12
13
0.295
(0.012)
0.694
(0.027)
1.095
(0.043)
1.494
(0.059)
2.503
(0.099)
2.096
(0.083)
1.495
(0.059)
1.095
(0.043)
0.695
(0.027)
0.295
(0.012)
0.0
0.0
0.605
(0.024)
14
2.096
(0.083)
2.705
(0.107)
0.638
(0.025)
3.000
(0.118)
Bias Arrangement
1
2
3
4
5
6
7
8
9
10
11
12
13
14
RF In
Vg1
RF Out
Vd1
Vg3,4,5
Vg6
Vg2
Vd2
Vd3,4,5
Vd6
BypassCapacitors - See App Note [2]


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