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TS5A3166-Q1 Arkusz danych(PDF) 4 Page - Texas Instruments |
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TS5A3166-Q1 Arkusz danych(HTML) 4 Page - Texas Instruments |
4 / 30 page TS5A3166-Q1 SCDS357A – JULY 2014 – REVISED DECEMBER 2014 www.ti.com 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VI/O Input/output voltage 0 5.5 V V+ Supply voltage 0 5.5 V VI Control Input Voltage 0 5.5 V TA Operating free-air temperature –40 125 °C 7.4 Thermal Information TS5A3166-Q1 THERMAL METRIC(1) DCK UNIT 5 PINS RθJA Junction-to-ambient thermal resistance 283.1 RθJC(top) Junction-to-case (top) thermal resistance 92.2 RθJB Junction-to-board thermal resistance 60.8 °C/W ψJT Junction-to-top characterization parameter 1.7 ψJB Junction-to-board characterization parameter 60.0 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: TS5A3166-Q1 |
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