CS1124

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7

PACKAGE DIMENSIONS

SOIC−8 NB

CASE 751−07

ISSUE AG

SEATING

PLANE

1

4

5

8

N

J

X 45

_

K

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW

STANDARD IS 751−07.

A

B

S

D

H

C

0.10 (0.004)

DIM

A

MIN

MAX

MIN

MAX

INCHES

4.80

5.00

0.189

0.197

MILLIMETERS

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.053

0.069

D

0.33

0.51

0.013

0.020

G

1.27 BSC

0.050 BSC

H

0.10

0.25

0.004

0.010

J

0.19

0.25

0.007

0.010

K

0.40

1.27

0.016

0.050

M

0

8

0

8

N

0.25

0.50

0.010

0.020

S

5.80

6.20

0.228

0.244

−X−

−Y−

G

M

Y

M

0.25 (0.010)

−Z−

Y

M

0.25 (0.010)

Z

S

M

____

1.52

0.060

7.0

0.275

0.6

0.024

1.270

0.050

4.0

0.155

mm

inches

SCALE 6:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

PACKAGE THERMAL DATA

Parameter

SOIC−8NB

Unit

Typical

45

°C/W

Typical

165

°C/W