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TL062CDG4 Arkusz danych(PDF) 5 Page - Texas Instruments

Numer części TL062CDG4
Szczegółowy opis  Low-Power JFET-Input Operational Amplifiers
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
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TL062CDG4 Arkusz danych(HTML) 5 Page - Texas Instruments

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TL061, TL061A, TL061B
TL062, TL062A, TL062B, TL064, TL064A, TL064B
www.ti.com
SLOS078L – NOVEMBER 1978 – REVISED MAY 2015
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
2000
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC+
Supply voltage
5
15
V
VCC–
Supply voltage
–5
–15
V
VCM
Common-mode voltage
VCC– + 4
VCC+ – 4
V
TL06xM
–55
125
TL06xQ
–40
125
TA
Ambient temperature
°C
TL06xI
–40
85
TL06xC
0
70
6.4 Thermal Information - 8 Pins
TL06xx
THERMAL METRIC(1)
D (SOIC)
P (PDIP)
PS (SO)
PW (TSSOP)
JG (CDIP)
UNIT
8 PINS
8 PINS
8 PINS
8 PINS
8 PINS
RθJ Junction-to-ambient thermal
97
85
95
149
°C/W
A
resistance(2)(3)
RθJ
Junction-to-case (top) thermal
C(to
14.5
°C/W
resistance(4)(5)
p)
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3)
The package thermal impedance is calculated in accordance with JESD 51-7.
(4)
Maximum power dissipation is a function of TJ(max), RθJC, and TC. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TC) / RθJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
(5)
The package thermal impedance is calculated in accordance with MIL-STD-883.
6.5 Thermal Information - 14 Pins
TL06xx
D (SOIC)
N (PDIP)
NS (SO)
PS (SO)
PW
J (CDIP)
W (CFP)
THERMAL METRIC(1)
UNIT
(TSSOP)
14 PINS
14 PINS
14 PINS
8 PINS
14 PINS
14 PINS
14 PINS
RθJ Junction-to-ambient thermal
113
86
80
76
95
°C/W
A
resistance(2)(3)
RθJ
Junction-to-case (top) thermal
C(to
15.05
14.65
°C/W
resistance(2)(3)
p)
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
Maximum power dissipation is a function of TJ(max), RθJC, and TC. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TC) / RθJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3)
The package thermal impedance is calculated in accordance with MIL-STD-883.
Copyright © 1978–2015, Texas Instruments Incorporated
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Product Folder Links: TL061 TL061A TL061B TL062 TL062A TL062B TL064 TL064A TL064B


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