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AD9154 Arkusz danych(PDF) 11 Page - Analog Devices |
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AD9154 Arkusz danych(HTML) 11 Page - Analog Devices |
11 / 124 page Data Sheet AD9154 Rev. B | Page 11 of 124 ABSOLUTE MAXIMUM RATINGS Table 10. Parameter Rating I120 to Ground −0.3 V to AVDD33 + 0.3 V SERDINx±, V TT, SYNCOUTx±, and TXENx −0.3 V to SIOVDD33 + 0.3 V OUTx± −0.3 V to AVDD33 + 0.3 V SYSREF± GND − 0.5 V CLK± to Ground −0.3 V to PVDD12 + 0.3 V RESET, IRQ, CS, SCLK, SDIO, SDO, and PDP OUTx to Ground −0.3 V to IOVDD + 0.3 V LDO_BYP1 −0.3 V to SVDD12 + 0.3 V LDO_BYP2 −0.3 V to PVDD12 + 0.3 V Ambient Operating Temperature (T A) −40°C to +85°C Junction Temperature 125°C Storage Temperature −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE The exposed pad (EPAD) must be soldered to the ground plane for the 88-lead LFCSP. The EPAD provides an electrical, thermal, and mechanical connection to the board. Typical θJA, θJB, and θJC values are specified for a 4-layer, JESD51-7 high effective thermal conductivity test board for leaded surface-mount packages. θJA is obtained in still air conditions (JESD51-2). Airflow increases heat dissipation, effectively reducing θJA. θJB is obtained following double-ring cold plate test conditions (JESD51-8). θJC is obtained with the test case temperature moni- tored at the bottom of the exposed pad. ΨJT and ΨJB are thermal characteristic parameters obtained with θJA in still air test conditions. Junction temperature (TJ) can be estimated using the following equations: TJ = TT + (ΨJT × P), or TJ = TB + (ΨJB × P) where: TT is the temperature measured at the top of the package. P is the total device power dissipation. TB is the temperature measured at the board. Table 11. Thermal Resistance Package θ JA θ JB θ JC Ψ JT Ψ JB Unit 88-Lead LFCSP1 22.6 5.59 1.17 0.1 5.22 °C/W 1 The exposed pad must be securely connected to the ground plane. ESD CAUTION |
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