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TL16C752CI-Q1 Arkusz danych(PDF) 6 Page - Texas Instruments

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Numer części TL16C752CI-Q1
Szczegółowy opis  Dual UART
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
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TL16C752CI-Q1
SLLSEQ9A – OCTOBER 2015 – REVISED FEBRUARY 2016
www.ti.com
Product Folder Links: TL16C752CI-Q1
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
Pin Functions (continued)
PIN
TYPE
DESCRIPTION
NAME
NO.
RTSA
33
O
Request to send (active low). These outputs are associated with individual UART channels A and B.
A low on the RTS pins indicates the transmitter has data ready and waiting to send. Writing a 1 in the
modem control register (MCR[1]) sets these pins to low, indicating data is available. After a reset,
these pins are set to 1. These pins only affect the transmit and receive operation when auto-RTS
function is enabled through the enhanced feature register (EFR[6]), for hardware flow control
operation.
RTSB
22
RXA
5
I
Receive data input. These inputs are associated with individual serial channel data to the
TL16C752CI-Q1 device. During the local loopback mode, these RX input pins are disabled and TX
data is internally connected to the UART RX input internally. During normal mode, RXn should be
held high when no data is being received. These inputs also can be used in IrDA mode. For more
information, see IrDA Overview.
RXB
4
RXRDYA
31
O
Receive ready (active low). RXRDYA and RXRDYB go low when the trigger level has been reached
or a timeout interrupt occurs. They go high when the RX FIFO is empty or there is an error in RX
FIFO.
RXRDYB
18
TXA
7
O
Transmit data. These outputs are associated with individual serial transmit channel data from the
TL16C752CI-Q1 device. During the local loopback mode, the TX input pin is disabled and TX data is
internally connected to the UART RX input.
TXB
8
TXRDYA
43
O
Transmit ready (active low). TXRDYA and TXRDYB go low when there are a trigger level number of
spares available. They go high when the TX buffer is full.
TXRDYB
6
VCC
42
PWR
Power supply inputs
XTAL1
13
I
Crystal or external clock input. XTAL1 functions as a crystal input or as an external clock input. A
crystal can be connected between XTAL1 and XTAL2 to form an internal oscillator circuit.
Alternatively, an external clock can be connected to XTAL1 to provide custom data rates.
XTAL2
14
O
Output of the crystal oscillator or buffered clock. See also XTAL1. XTAL2 is used as a crystal
oscillator output or buffered clock output.
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
6
V
VI
Input voltage
–0.5
VCC + 0.5
V
VO
Output voltage
–0.5
VCC + 0.5
V
TA
Operating free-air temperature
–40
105
°C
Tstg
Storage temperature
–65
150
°C
(1)
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic
discharge
Human-body model (HBM), per AEC Q100-002(1)
±2000
V
Charged-device model (CDM), per AEC Q100-011
±1000


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