02014-DSH-001-D

Mindspeed Technologies

®

6

Mindspeed Proprietary and Confidential

2.0 Pin Definitions

Table 2-1.

Pad Description

Die Pad No

Name

Function

1

AGC

Monitor or force AGC voltage

3

PINK

4

PINA

Active PIN input. Connect to photo diode anode

6

MON

Analog current source output. Current matched to average photodiode current.

Intended for photo-alignment use only

7

DOUT

Differential data output (goes low as light increases)

8DOUTGND

9

GND

10

GND

11

DOUTGND

12

DOUT

Differential data output (goes high as light increases)

NA

Backside

Backside. Connect to the lowest potential, usually ground

NOTES:

1.

2.

All ground pads are common on the die. Only one ground pad needs to be connected to the TO-Can ground. However, connecting more than one

ground pad to the TO-Can ground, particularly those across the die from each other can improve performance in noisy environments.

Figure 2-1.

Bare Die Layout

MON

PINA

PINK

V

CC

AGC

DOUT

GND

GND

DOUTGND

1

2

3

4

56

7

8

9

10

11

12

V

CC

DOUT

DOUTGND