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M02013 Arkusz danych(PDF) 9 Page - M/A-COM Technology Solutions, Inc. |
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M02013 Arkusz danych(HTML) 9 Page - M/A-COM Technology Solutions, Inc. |
9 / 21 page M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: http://www.macom.com/support M02013 9 CMOS Transimpedance Amplifier with AGC for Fiber-optic Networks up to 3.2 Gbps Rev V8 2.0 Pin/Pad Definitions 2.1 Pin/Pad Definitions Table 2-1. Pin/Pad Definitions Die Pad No Name Function 1 AGC Monitor or force AGC voltage 2VCC Power pin. Connect to most positive supply 3 PINK Common PIN input. Connect photo diode cathode here and a 470 pF capacitor to Gnd (1) 4 PINA Active PIN input. Connect to photo diode anode 5VCC Power pin. Connect to most positive supply (only one VCC pad needs to be connected) 6 MON Analog current sink output. Current matched to average photodiode current 7DOUT Differential data output (goes low as light increases) 8DOUTGND Ground return for DOUT pad (all GND pads must be connected) 9 GND Ground pin. Connect to the most negative supply (2) 10 GND Ground pin. Connect to the most negative supply (2) 11 DOUTGND Ground return for DOUT pad (2) 12 DOUT Differential data output (goes high as light increases) NA Backside Backside. Connect to the lowest potential, usually ground NOTES: 1. Alternatively the photodiode cathode may be connected to a decoupled positive supply, e.g. VCC. 2. All ground pads are common on the die. Only one ground pad needs to be connected to the TO-Can ground. However, connecting more than one ground pad to the TO-Can ground, particularly those across the die from each other can improve performance in noisy environments. |
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