4

Rev1.0, Apr 6, 2016

www.seoulsemicon.com

Product Data Sheet

SAW81F1D

– Chip on Board

 “제품 명 – 제품 군” 을 기입하십시오.

제품 군은 홈페이지 응용분야 분류기준을 참고한다.

(예) SZ5M0WWC9 – High-power LED

Font 글씨체

표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body)

– Arial 9pt

 Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….

• Final 승인원: 1.0 부터 시작

• 기존에서 일부 수정: +0.1

• 새로운 Data 추가 /또는 기존 것 삭제: +1.0

 수정일자 표기형식; YYYY-MM-DD

(예) 2013-04-01

Performance Characteristics

 전기적 특성 및 광 특성 스펙 테이블

Parameter

Symbol

Value

Unit

Min.

Typ.

Max.

Forward Current

-

20

40

mA

Power Dissipation

-

3.7

7.6

W

Junction Temperature

[1]

-

-

125

ºC

Operating Temperature

-40

-

85

ºC

Surface Temperature

-

-

100

ºC

Storage Temperature

-40

-

100

ºC

Thermal resistance (J to S)

-

2.9

-

K/W

ESD Sensitivity(HBM)

[2]

-

Class 2A JESD22-A114-E

Table 3. Absolute Maximum Characteristics, T

1.

At thermal Resistance, J to S means junction to COB’s metal PCB bottom.

2.

At ESD Sensitivity, Class 2 is voltage level between 2000V and 4000V.

3.

Thermal resistance : Rth

Notes for Table 3 :

•

LED’s properties might be different from suggested values like above and below tables if

operation condition will be exceeded our parameter range. Care is to be taken that power

dissipation does not exceed the absolute maximum rating of the product.

•

Thermal resistance can be increased substantially depending on the heat sink design/operating

condition, and the maximum possible driving current will decrease accordingly.

•

All measurements were made under the standardized environment of Seoul Semiconductor.