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LM25122-Q1 Arkusz danych(PDF) 5 Page - Texas Instruments |
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LM25122-Q1 Arkusz danych(HTML) 5 Page - Texas Instruments |
5 / 47 page LM25122-Q1 www.ti.com SNVSAF0A – DECEMBER 2015 – REVISED DECEMBER 2015 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per AEC Q100-002(1) ±2000 Corner pins (1, 10, 11, ±1000 V(ESD) Electrostatic discharge V Charged device model (CDM), per AEC and 20) Q100-011 Other pins ±1000 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.3 Recommended Operating Conditions (1) over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Input supply voltage(2) VIN 4.5 42 V Low-side driver bias voltage VCC 14 V High-side driver bias voltage BST to SW 3.8 14 V Current sense common mode CSP, CSN V 3 42 range(2) Switch node voltage SW 50 V Junction temperature TJ –40 125 ºC (1) Recommended Operating Conditions are conditions under which operation of the device is intended to be functional, but does not guarantee specific performance limits. (2) Minimum VIN operating voltage is always 4.5 V. The minimum input power supply voltage can be 3.0 V after start-up, assuming VIN voltage is supplied from an available external source. 6.4 Thermal Information LM25122-Q1 PWP THERMAL METRIC(1) UNIT (HTSSOP) 20 PINS RθJA Junction-to-ambient thermal resistance 36.0 ºC/W RθJC(top) Junction-to-case (top) thermal resistance 20.1 ºC/W RθJB Junction-to-board thermal resistance 16.8 ºC/W ψJT Junction-to-top characterization parameter 0.4 ºC/W ψJB Junction-to-board characterization parameter 16.7 ºC/W ψJCbot Junction-to-case (bottom) thermal resistance 1.7 ºC/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LM25122-Q1 |
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