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TLP797GA Arkusz danych(PDF) 2 Page - Toshiba Semiconductor

Numer części TLP797GA
Szczegółowy opis  Cordless Telephone PBX MODEM
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Producent  TOSHIBA [Toshiba Semiconductor]
Strona internetowa  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP797GA Arkusz danych(HTML) 2 Page - Toshiba Semiconductor

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TLP797GA
2014-09-22
2
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Unit
LED
Forward current
IF
50
mA
Forward current derating
(Ta
≥ 25°C)
ΔIF/°C
−0.5
mA/
°C
Peak forward current
(100
μs pulse, 100 pps)
IFP
1
A
Reverse voltage
VR
5
V
Junction temperature
Tj
125
°C
Detector
Off-state output terminal voltage
VOFF
400
V
On-state current
A connection
ION
120
mA
B connection
120
C connection
240
On-state current
derating
(Ta
≥ 25°C)
A connection
ΔION/°C
−1.2
mA/
°C
B connection
−1.2
C connection
−2.4
Junction temperature
Tj
125
°C
Storage temperature range
Tstg
−55 to 125
°C
Operating temperature range
Topr
−40 to 85
°C
Lead soldering temperature (10 s)
Tsol
260
°C
Isolation voltage (AC, 1 minute, R.H.
≤ 60%)
(Note)
BVS
5000
Vrms
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note: Device considered a two-terminal device: Pins1, 2 and 3 shorted together, and pins 4, 5 and 6 shorted together.
Recommended Operating Conditions
Characteristics
Symbol
Min
Typ.
Max
Unit
Supply voltage
VDD
320
V
Forward current
IF
5
7.5
25
mA
On-state current
ION
120
mA
Operating temperature
Topr
−20
65
°C
Note: Recommended operating conditions are given as a design guideline to obtain expected performance of the
device. Additionally, each item is an independent guideline respectively. In developing designs using this
product, please confirm specified characteristics shown in this document.


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