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LMZ13608TZE Arkusz danych(PDF) 11 Page - Texas Instruments |
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LMZ13608TZE Arkusz danych(HTML) 11 Page - Texas Instruments |
11 / 35 page 0 2 4 6 8 10 12 3 6 9 12 15 18 21 24 27 30 COPPER AREA (in 2 ) 2 Layer 0 LFPM 2 Layer 225 LFPM 4 Layer 0 LFPM 4 Layer 225 LFPM 20 30 40 50 60 70 80 90 100 110 120 0 2 4 6 8 10 TEMPERATURE (C) JA = 9.9 °C/W JA = 6.8 °C/W JA = 5.2 °C/W LMZ13608 www.ti.com SNVS710I – MARCH 2011 – REVISED DECEMBER 2015 Typical Characteristics (continued) Unless otherwise specified, the following conditions apply: VIN = 12 V; CIN = three × 10 μF + 47-nF X7R Ceramic; COUT = two × 330- μF Specialty Polymer + 47-µF Ceramic + 47-nF Ceramic; CFF = 4.7 nF; TA = 25° C for waveforms. All indicated temperatures are ambient. VIN = 24 V, VOUT = 3.3 V Figure 31. Thermal Derating Figure 32. θJA vs Copper Heat Sinking Area 12 VIN, 5 VOUT at Full Load, BW = 20 MHz 12 VIN, 5 VOUT at Full Load, BW = 250 MHz Figure 33. Output Ripple Figure 34. Output Ripple 12 VIN, 3.3 VOUT at Full Load, BW = 250 MHz 12 VIN, 3.3 VOUT at Full Load, BW = 20 MHz Figure 36. Output Ripple Figure 35. Output Ripple Copyright © 2011–2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: LMZ13608 |
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