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LMZ12010TZ Arkusz danych(PDF) 3 Page - Texas Instruments |
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LMZ12010TZ Arkusz danych(HTML) 3 Page - Texas Instruments |
3 / 35 page PGND/EP Connect to AGND 5 AGND 6 AGND 3 AGND 1 VIN 2 VIN 4 EN 7 FB SS 9 NC 10 VOUT 11 VOUT 8 LMZ12010 www.ti.com SNVS667H – FEBRUARY 2010 – REVISED AUGUST 2015 5 Pin Configuration and Functions NDY Package 11-Pin Top View Pin Functions PIN TYPE DESCRIPTION NAME NO. AGND 2 Ground Analog Ground — Reference point for all stated voltages. Must be externally connected to PGND(EP). 5 6 EN 4 Analog Enable — Input to the precision enable comparator. Rising threshold is 1.274 V typical. Once the module is enabled, a 13-µA source current is internally activated to facilitate programmable hysteresis. FB 7 Analog Feedback — Internally connected to the regulation amplifier and over-voltage comparator. The regulation reference point is 0.795V at this input pin. Connect the feedback resistor divider between VOUT and AGND to set the output voltage. NC 9 — No Connect — This pin must remain floating, do not ground. PGND — Ground Exposed Pad / Power Ground — Electrical path for the power circuits within the module. PGND is not internally connected to AGND (pin 5,6). Must be electrically connected to pins 5 and 6 external to the package. The exposed pad is also used to dissipate heat from the package during operation. Use one hundred 12 mil thermal vias from top to bottom copper for best thermal performance. SS 8 Analog Soft-Start/Track Input — To extend the 1.6-ms internal soft-start connect an external soft-start capacitor. For tracking connect to an external resistive divider connected to a higher priority supply rail. See Detailed Design Procedure section. VIN 1 Power Input supply — Nominal operating range is 6 V to 20 V. A small amount of internal capacitance is contained within the package assembly. Additional external input capacitance is required 2 between this pin and the exposed pad (PGND). VOUT 10 Power Output Voltage — Output from the internal inductor. Connect the output capacitor between this pin and exposed pad (PGND). 11 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT VIN to PGND –0.3 24 V EN to AGND –0.3 5.5 V SS, FB to AGND –0.3 2.5 V AGND to PGND –0.3 0.3 V Junction Temperature 150 °C Peak Reflow Case Temperature (30 sec) 245 °C Storage Temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) For soldering specifications, refer to the following document: SNOA549 Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LMZ12010 |
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