PGND/EP

Connect to AGND

5

AGND

6

AGND

3

AGND

1

VIN

2

VIN

4

EN

7

FB

SS

9

NC

10

VOUT

11

VOUT

8

LMZ12010

www.ti.com

SNVS667H – FEBRUARY 2010 – REVISED AUGUST 2015

5 Pin Configuration and Functions

NDY Package

11-Pin

Top View

Pin Functions

PIN

TYPE

DESCRIPTION

NAME

NO.

AGND

2

Ground

Analog Ground — Reference point for all stated voltages. Must be externally connected to

PGND(EP).

5

6

EN

4

Analog

Enable — Input to the precision enable comparator. Rising threshold is 1.274 V typical. Once

the module is enabled, a 13-µA source current is internally activated to facilitate programmable

hysteresis.

FB

7

Analog

Feedback — Internally connected to the regulation amplifier and over-voltage comparator. The

regulation reference point is 0.795V at this input pin. Connect the feedback resistor divider

between VOUT and AGND to set the output voltage.

NC

9

—

No Connect — This pin must remain floating, do not ground.

PGND

—

Ground

Exposed Pad / Power Ground — Electrical path for the power circuits within the module. PGND

is not internally connected to AGND (pin 5,6). Must be electrically connected to pins 5 and 6

external to the package. The exposed pad is also used to dissipate heat from the package

during operation. Use one hundred 12 mil thermal vias from top to bottom copper for best

thermal performance.

SS

8

Analog

Soft-Start/Track Input — To extend the 1.6-ms internal soft-start connect an external soft-start

capacitor. For tracking connect to an external resistive divider connected to a higher priority

supply rail. See Detailed Design Procedure section.

VIN

1

Power

Input supply — Nominal operating range is 6 V to 20 V. A small amount of internal capacitance

is contained within the package assembly. Additional external input capacitance is required

2

between this pin and the exposed pad (PGND).

VOUT

10

Power

Output Voltage — Output from the internal inductor. Connect the output capacitor between this

pin and exposed pad (PGND).

11

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

VIN to PGND

–0.3

24

V

EN to AGND

–0.3

5.5

V

SS, FB to AGND

–0.3

2.5

V

AGND to PGND

–0.3

0.3

V

Junction Temperature

150

°C

Peak Reflow Case Temperature (30 sec)

245

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

For soldering specifications, refer to the following document: SNOA549

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