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TS3A27518EZQSR Arkusz danych(PDF) 5 Page - Texas Instruments

Numer części TS3A27518EZQSR
Szczegółowy opis  6-Channel, 1:2 Multiplexer/Demultiplexer
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Producent  TI1 [Texas Instruments]
Strona internetowa  http://www.ti.com
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TS3A27518E
www.ti.com
SCDS260D – MARCH 2009 – REVISED MAY 2016
Product Folder Links: TS3A27518E
Submit Documentation Feedback
Copyright © 2009–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(3)
All voltages are with respect to ground, unless otherwise specified.
(4)
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(5)
This value is limited to 5.5-V maximum.
(6)
Requires clamp diodes on analog port to VCC.
(7)
Pulse at 1-ms duration < 10% duty cycle.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VCC
Supply voltage (3)
–0.5
4.6
V
VNC
VNO
VCOM
Analog signal voltage (3) (4) (5)
–0.5
4.6
V
IK
Analog port diode current (6)
VCC < VNC, VNO, VCOM < 0
–50
mA
INC
INO
ICOM
ON-state switch current (7)
VNC, VNO, VCOM = 0 to VCC
–50
50
mA
VI
Digital input voltage (3) (4)
–0.5
4.6
V
IIK
Digital input clamp current (3) (4)
VIO < VI < 0
–50
mA
ICC
Continuous current through VCC
100
mA
IGND
Continuous current through GND
–100
mA
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2500
V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
Supply voltage
VCC
1.65
3.6
V
Analog signal voltage
VNC
0
VCC
V
VNO
VCOM
Digital input voltage
VI
0
VCC
V
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC (1)
TS3A27518E
UNIT
PW
(TSSOP)
RTW
(WQFN)
ZQS (BGA
MICROSTAR JUNIOR)
24 PINS
24 PINS
24 PINS
RθJA
Junction-to-ambient thermal resistance
104
40.7
155.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
51.6
42.9
69.9
°C/W
RθJB
Junction-to-board thermal resistance
57.5
19.2
94.6
°C/W


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