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TS5A22362DGSRG4 Arkusz danych(PDF) 5 Page - Texas Instruments |
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TS5A22362DGSRG4 Arkusz danych(HTML) 5 Page - Texas Instruments |
5 / 30 page TS5A22362 www.ti.com SCDS364B – JUNE 2015 – REVISED SEPTEMBER 2015 6.4 Thermal Information TS5A22362 THERMAL METRIC (1) DGS (VSSOP) DRC (VSON) YZP (DSBGA) UNIT 10 PINS 10 PINS 10 PINS RθJA Junction-to-ambient thermal resistance 163.3 44.3 90.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 56.4 70.1 0.3 °C/W RθJB Junction-to-board thermal resistance 83.1 19.3 8.3 °C/W ψJT Junction-to-top characterization parameter 6.8 2.0 3.2 °C/W ψJB Junction-to-board characterization parameter 81.8 19.4 8.3 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.5 Electrical Characteristics for 2.5-V Supply VCC = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted) (1) PARAMETER TEST CONDITIONS TA VCC MIN TYP MAX UNIT Analog Switch VCOM, Analog signal VCC – 5.5 VCC V VNO, VNC range VNC or VNO = VCC, 1.5 V, 25°C 0.65 0.94 ON-state COM to NO or NC, Ron VCC – 5.5 V 2.7 V Ω resistance see Figure 13 Full 1.3 ICOM = –100 mA, ON-state 25°C 0.023 0.11 VNC or VNO = 1.5 V, COM to NO or NC, ΔRon resistance match 2.7 V Ω ICOM = –100 mA, see Figure 13 Full 0.15 between channels ON-state VNC or VNO = VCC, 1.5 V, 25°C 0.18 0.46 COM to NO or NC, Ron(flat) resistance VCC – 5.5 V 2.7 V Ω see Figure 13 Full 0.5 flatness ICOM = –100 mA, VNC = 2.25 V, VCC – 5.5 V 25°C –50 50 VCOM = VCC – 5.5 V, 2.25 V VNO = Open NC, NO COM to NO INC(OFF), OFF leakage or See Figure 14 2.7 nA INO(OFF) Full –375 375 current VNO = 2.25 V, VCC – 5.5 V, VCOM = VCC – 5.5 V, 2.25 V VNC = Open COM to NC COM 25°C –50 50 VNC and VNO = Floating, ICOM(ON) ON leakage See Figure 15 2.7 V nA VCOM = VCC,VCC – 5.5 V Full –375 375 current Digital Control Inputs (IN) (2) VIH Input logic high 1.4 5.5 Full V VIL Input logic low 0.6 25°C –250 250 Input leakage IIH, IIL VIN = VCC or 0 2.7 V nA current Full –250 250 Dynamic 25°C 2.5 V 44 80 VCOM = VCC, CL = 35 pF, tON Turnon time ns 2.3 V to 2.7 RL = 300 Ω, see Figure 17 Full 120 V 25°C 2.5 V 22 70 VCOM = VCC, CL = 35 pF, tOFF Turnoff time ns 2.3 V to 2.7 RL = 300 Ω, see Figure 17 Full 70 V Break-before-make tBBM See Figure 18 25°C 2.5 V 1 7 ns time VGEN = 0, CL = 1 nF, QC Charge injection 25°C 2.5 V 150 pC RGEN = 0, see Figure 22 CNC(OFF), NC, NO VNC or VNO = VCC or GND, See Figure 16 25°C 2.5 V 70 pF CNO(OFF) OFF capacitance NC, NO, COM VCOM = VCC or GND, CCOM(ON) See Figure 16 25°C 2.5 V 370 pF ON capacitance Switch ON, f = 10 MHz (1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum (2) All unused digital inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TS5A22362 |
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