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SBW5089Z Arkusz danych(PDF) 6 Page - RF Micro Devices

Numer części SBW5089Z
Szczegółowy opis  MMIC AMPLIFIER
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Producent  RFMD [RF Micro Devices]
Strona internetowa  http://www.rfmd.com
Logo RFMD - RF Micro Devices

SBW5089Z Arkusz danych(HTML) 6 Page - RF Micro Devices

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DS150923
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
SBW-5089(Z)
Suggested Pad Layout
Notes:
1. Solder the copper pad on the backside of the device package to the ground plane.
2. Provide a large ground pad area under device pins 1, 2, 4, and 5 with many plated via holes as shown.
3. Dimensions given for 50
 I/O lines are for 31mil thick Getek. Scale accordingly for different board thicknesses and dielec-
tric contacts.
4. We recommend 1 or 2 ounce copper. Measurements for this data sheet were made on a 31mil thick Getek with 1 ounce
copper on both sides.
*Bias Resistance=RBIAS + RLDC=(VS-VD)/ID
Select RBIAS so that RBIAS + RLDC ~the recommended bias resistance. Use 1% or 5% tolerance resistors or parallel combinations to attain the recom-
mended bias resistance ±3%. RBIAS provides current stability over temperature.
*N/R=Not recommended. Contact RFMD technical support for guidance when available supply voltage is <7V.
Pin
Function
Description
1RF IN
RF input pin. This pin requires the use of an external DC-blocking capacitor chosen for the frequency of opera-
tion.
2, 4
GND
Connection to ground. Provide via holes as close to the device ground leads as possible to reduce ground induc-
tance and achieve RF performance.
3RF OUT/DC
BIAS
RF output and bias pin. This pin requires the use of an external DC-blocking capacitor chosen for the frequency
of operation.
PCB Pad Layout
Dimensions in inches [millimeters]


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