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AD7175-8BCPZ-RL Arkusz danych(PDF) 8 Page - Analog Devices

Numer części AD7175-8BCPZ-RL
Szczegółowy opis  24-Bit, 8-/16-Channel, 250 kSPS, Sigma- Delta ADC with True Rail-to-Rail Buffers
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Producent  AD [Analog Devices]
Strona internetowa  http://www.analog.com
Logo AD - Analog Devices

AD7175-8BCPZ-RL Arkusz danych(HTML) 8 Page - Analog Devices

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AD7175-8
Data Sheet
Rev. 0 | Page 8 of 64
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
AVDD1, AVDD2 to AVSS
−0.3 V to +6.5 V
AVDD1 to DGND
−0.3 V to +6.5 V
IOVDD to DGND
−0.3 V to +6.5 V
IOVDD to AVSS
−0.3 V to +7.5 V
AVSS to DGND
−3.25 V to +0.3 V
Analog Input Voltage to AVSS
−0.3 V to AVDD1 + 0.3 V
Reference Input Voltage to AVSS
−0.3 V to AVDD1 + 0.3 V
Digital Input Voltage to DGND
−0.3 V to IOVDD + 0.3 V
Digital Output Voltage to DGND
−0.3 V to IOVDD + 0.3 V
Analog Input/Digital Input Current
10 mA
Operating Temperature Range
−40°C to +105°C
Storage Temperature Range
−65°C to +150°C
Maximum Junction Temperature
150°C
Lead Soldering, Reflow Temperature
260°C
ESD Rating (Human Body Model)
4 kV
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for a device soldered on a JEDEC test board for
surface-mount packages.
Table 4. Thermal Resistance
Package Type
θ
JA
Unit
40-Lead, 6 mm × 6 mm LFCSP
1-Layer JEDEC Board
114
°C/W
4-Layer JEDEC Board
54
°C/W
4-Layer JEDEC Board with 16 Thermal Vias
34
°C/W
ESD CAUTION


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