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8XC51FB Arkusz danych(PDF) 2 Page - NXP Semiconductors |
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8XC51FB Arkusz danych(HTML) 2 Page - NXP Semiconductors |
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2 / 58 page  2003 Oct 30 2 Philips Semiconductors Product specification Low power single card reader TDA8029 CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 APPLICATIONS 4 QUICK REFERENCE DATA 5 ORDERING INFORMATION 6 BLOCK DIAGRAM 7 PINNING 8 FUNCTIONAL DESCRIPTION 8.1 Microcontroller 8.1.1 Port characteristics 8.1.2 Oscillator characteristics 8.1.3 Reset 8.1.4 Low power modes 8.2 Timer 2 operation 8.2.1 Timer/counter 2 Control register (T2CON) 8.2.2 Timer/counter 2 Mode control register (T2MOD) 8.2.3 Auto-reload mode (up- or down-counter) 8.2.4 Baud rate generator mode 8.2.5 Timer/counter 2 set-up 8.3 Enhanced UART 8.3.1 Serial port Control register (SCON) 8.3.2 Automatic address recognition 8.4 Interrupt priority structure 8.4.1 Interrupt Enable (IE) register 8.4.2 Interrupt Priority (IP) register 8.4.3 Interrupt Priority High (IPH) register 8.5 Dual Data Pointer (DPTR) 8.6 Expanded data RAM addressing 8.6.1 Auxiliary Register (AUXR) 8.7 Reduced EMI mode 8.8 Mask ROM devices 8.9 ROM code submission for 16 kbytes ROM device TDA8029 8.10 Smart card reader control registers 8.10.1 General registers 8.10.1.1 Card Select Register (CSR) 8.10.1.2 Hardware Status Register (HSR) 8.10.1.3 Time-Out Registers (TOR1, TOR2 and TOR3) 8.10.1.4 Time-Out Configuration register (TOC) 8.10.2 ISO UART registers 8.10.2.1 UART Transmit Register (UTR) 8.10.2.2 UART Receive Register (URR) 8.10.2.3 Mixed Status Register (MSR) 8.10.2.4 FIFO Control Register (FCR) 8.10.2.5 UART Status Register (USR) 8.10.3 Card registers 8.10.3.1 Programmable Divider Register (PDR) 8.10.3.2 UART Configuration Register 2 (UCR2) 8.10.3.3 Guard Time Register (GTR) 8.10.3.4 UART Configuration Register 1 (UCR1) 8.10.3.5 Clock Configuration Register (CCR) 8.10.3.6 Power Control Register (PCR) 8.10.4 Register summary 8.11 Supply 8.12 DC/DC converter 8.13 ISO 7816 security 8.14 Protections and limitations 8.15 Power reduction modes 8.16 Activation sequence 8.17 Deactivation sequence 9 LIMITING VALUES 10 HANDLING 11 THERMAL CHARACTERISTICS 12 CHARACTERISTICS 13 APPLICATION INFORMATION 14 PACKAGE OUTLINE 15 SOLDERING 15.1 Introduction to soldering surface mount packages 15.2 Reflow soldering 15.3 Wave soldering 15.4 Manual soldering 15.5 Suitability of surface mount IC packages for wave and reflow soldering methods 16 DATA SHEET STATUS 17 DEFINITIONS 18 DISCLAIMERS |
Podobny numer części - 8XC51FB |
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Podobny opis - 8XC51FB |
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