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LM10692RMYT Arkusz danych(PDF) 6 Page - Texas Instruments |
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LM10692RMYT Arkusz danych(HTML) 6 Page - Texas Instruments |
6 / 48 page LM10692 SNVSA53 – JULY 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings (1) (2) (3) (4) over operating free-air temperature range (unless otherwise noted) (5) MIN MAX UNIT Any supply pin, VIN to GND -0.3 6 V Any signal pin -0.3 +(VIN+0.3)V but V not over 6.0V (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are measured with respect to the potential at the GND pins. (3) VIN refers to these power pins connected together: VIN_B1 = VIN_B2=VI_B3 = VIN_B4 = VIN_B5 = VIN_B6 = VIN (4) GND Pins means all ground pins must be connected together. (5) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range -65 150 °C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2000 V pins(1) V(ESD) Electrostatic discharge Charged device model (CDM), per JEDEC specification 1000 V JESD22-C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions (1) (2) (3) (4) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VIN, VIN_B2, VIN_B3, VIN_B4, VIN_B5 2.5 5.5 V VIN_B1, VIN_B6 2.5 4 V Junction Temperature, TJ -40 125 °C Ambient Temperature, TA -40 85 °C Storage Temperature -65 150 °C (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are measured with respect to the potential at the GND pins. (3) VIN refers to these power pins connected together: VIN_B1 = VIN_B2=VI_B3 = VIN_B4 = VIN_B5 = VIN_B6 = VIN (4) GND Pins means all ground pins must be connected together. 7.4 Thermal Information LM10692 THERMAL METRIC(1) RMY UNIT 36 PINS RθJA Junction-to-ambient thermal resistance 39.2 RθJC(top) Junction-to-case (top) thermal resistance 9.8 RθJB Junction-to-board thermal resistance 6.2 °C/W ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 6.2 RθJC(bot) Junction-to-case (bottom) thermal resistance 2.6 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: LM10692 |
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