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SM28VLT32SKGD3 Arkusz danych(PDF) 6 Page - Texas Instruments |
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SM28VLT32SKGD3 Arkusz danych(HTML) 6 Page - Texas Instruments |
6 / 16 page SM28VLT32-HT SLVSAO2C – NOVEMBER 2012 – REVISED MARCH 2013 www.ti.com DIE LAYOUT A. All dimensions are in microns B. Substrate can either float or be grounded C. Die thickness = 381 µm Table 1. Bare Die Information DIE DIE PAD BACKSIDE BACKSIDE FINISH THICKNESS COMPOSITION POTENTIAL 15 Mils AlCu/TiN Silicon with backgrind Float 6 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: SM28VLT32-HT |
Podobny numer części - SM28VLT32SKGD3 |
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