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LM3212 Arkusz danych(PDF) 1 Page - Texas Instruments |
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LM3212 Arkusz danych(HTML) 1 Page - Texas Instruments |
1 / 25 page FB EN VDD PVIN VCON SW VIN 2.7V to 5.5V VOUT 0.5V to 3.4V 10 PF 4.7 PF SGND PGND 2.2 PH LM3212 AUTO_BY PACB ACB 4.7 PF Switcher Side PA Side LM3212 www.ti.com SNOSB37C – DECEMBER 2008 – REVISED APRIL 2013 LM3212 Step-Down DC-DC Converter with Analog Bypass Mode for RF Power Amplifiers Check for Samples: LM3212 1 FEATURES DESCRIPTION The LM3212 is a DC-DC converter optimized for 2 • 1.6 MHz (typ.) PWM Switching Frequency powering GSM RF power amplifiers (PAs) from a • ACB Reduces Inductor Requirements and Size single Lithium-Ion cell; however, it may also be used • Operates From a Single Li-Ion Cell (2.7V to in other applications. The LM3212 steps down an 5.5V) input voltage from 2.7V to 5.5V to a dynamically adjustable output voltage of 0.5V to 3.4V. The output • Dynamically Adjustable Output Voltage (0.5V voltage is set through a VCON analog input that to 3.4V) adjusts the output voltage to ensure efficient • 2.5A Maximum Load Current operation at all power levels of the RF PA. • Analog Bypass Function With Low Bypass The LM3212 has a unique Active Current Bypass Resistance (33 m Ω typ.) (ACB) feature that speeds up output voltage transition • High Efficiency to 95% with Internal times, provides extra drive and a low-resistance Synchronous Rectification analog bypass. The LM3212 has an AUTO_BY pin to force the LM3212 into bypass mode during low input- • 16-bump DSBGA Package voltage operation thus overriding the automatic • Current Overload Protection analog bypass feature. Forced bypass can also be • Thermal Overload Protection achieved by setting VCON > VIN/2.5. In addition the LM3212 offers a fixed-frequency PWM APPLICATIONS mode to minimize RF interference and a shutdown • Battery-Powered 2G/3G/4G RF Power mode to turn the device off and reduce battery consumption to 0.02 µA (typ.) Amplifiers • Hand-Held Radios The LM3212 is available in a 16-bump lead-free DSBGA package. A 1.6 MHz switching frequency • RF PC Cards allows use of tiny surface-mount components for the required inductor and two ceramic capacitors. Typical Application 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 2008–2013, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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