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LM1086CT-5.0 Arkusz danych(PDF) 4 Page - Texas Instruments |
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LM1086CT-5.0 Arkusz danych(HTML) 4 Page - Texas Instruments |
4 / 30 page LM1086 SNVS039J – JUNE 2000 – REVISED APRIL 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT LM1086-ADJ 29 V LM1086-1.8 27 V Maximum Input to Output Voltage Differential LM1086-2.5 27 V LM1086-3.3 27 V LM1086-5.0 25 V Power Dissipation(3) Internally Limited Junction Temperature (TJ) (4) 150 °C Lead Temperature 260, to 10 sec °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. (3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application and Implementation. The value θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). (4) The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN MAX UNIT JUNCTION TEMPERATURE RANGE (TJ) (1) Control Section 0 125 °C "C" Grade Output Section 0 150 °C Control Section −40 125 °C "I" Grade Output Section −40 150 °C (1) The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal Considerations. 4 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated Product Folder Links: LM1086 |
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