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SN74AHC573-Q1 Arkusz danych(PDF) 5 Page - Texas Instruments |
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SN74AHC573-Q1 Arkusz danych(HTML) 5 Page - Texas Instruments |
5 / 32 page SN54AHC573, SN74AHC573 www.ti.com SCLS242L – OCTOBER 1995 – REVISED SEPTEMBER 2014 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) SN54AHC573 SN74AHC573 UNIT MIN MAX MIN MAX VCC Supply voltage 2 5.5 2 5.5 V VCC = 2 V 1.5 1.5 VIH High-level input voltage VCC = 3 V 2.1 2.1 V VCC = 5.5 V 3.85 3.85 VCC = 2 V 0.5 0.5 VIL Low-level input voltage VCC = 3 V 0.9 0.9 V VCC = 5.5 V 1.65 1.65 VI Input voltage 0 5.5 0 5.5 V VO Output voltage 0 VCC 0 VCC V VCC = 2 V –50 –50 µA IOH High-level output current VCC = 3.3 V ± 0.3 V –4 –4 mA VCC = 5 V ± 0.5 V –8 –8 VCC = 2 V 50 50 µA IOL Low-level output current VCC = 3.3 V ± 0.3 V 4 4 mA VCC = 5 V ± 0.5 V 8 8 VCC = 3.3 V ± 0.3 V 100 100 ∆t/∆v Input transition rise or fall rate ns/V VCC = 5 V ± 0.5 V 20 20 TA Operating free-air temperature –55 125 –40 125 °C (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). 7.4 Thermal Information SN74AHC573 THERMAL METRIC(1) DW DB DGV N NS PW UNIT 20 PINS RθJA Junction-to-ambient thermal resistance 79.4 97.9 117.2 53.3 79.2 103.3 RθJC(top) Junction-to-case (top) thermal resistance 45.7 59.6 32.7 40.0 45.7 37.8 RθJB Junction-to-board thermal resistance 46.9 53.1 58.7 34.2 46.8 54.3 °C/W ψJT Junction-to-top characterization parameter 18.7 21.3 1.15 26.4 19.3 2.9 ψJB Junction-to-board characterization parameter 46.5 52.7 58.0 34.1 46.4 53.8 RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a n/a (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). Copyright © 1995–2014, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: SN54AHC573 SN74AHC573 |
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