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MAX232ECNE4 Arkusz danych(PDF) 4 Page - Texas Instruments

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Numer części MAX232ECNE4
Szczegółowy opis  Dual RS-232 Driver and Receiver
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Strona internetowa  http://www.ti.com
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MAX232ECNE4 Arkusz danych(HTML) 4 Page - Texas Instruments

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4
MAX232E
SLLS723C – APRIL 2006 – REVISED AUGUST 2016
www.ti.com
Product Folder Links: MAX232E
Submit Documentation Feedback
Copyright © 2006–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to network GND.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Input supply voltage (2)
–0.3
6
V
VS+
Positive output supply voltage
VCC – 0.3
15
V
VS–
Negative output supply voltage
–0.3
–15
V
VI
Input voltage
Driver
–0.3
VCC + 0.3
V
Receiver
±30
VO
Output voltage
DOUT
VS– – 0.3
VS+ + 0.3
V
ROUT
–0.3
VCC + 0.3
Short-circuit duration
DOUT
Unlimited
TJ
Operating virtual junction temperature
150
°C
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Pins 7, 8,
13, and 14
±15000
V
Other pins
±3000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
All pins
±1500
IEC61000-4-2, air-gap discharge
Pins 7, 8,
13, and 14
±15000
IEC61000-4-2, contact discharge
±8000
6.3 Recommended Operating Conditions
MIN
NOM
MAX
UNIT
VCC
Supply voltage
4.5
5
5.5
V
VIH
High-level input voltage (DIN1, DIN2)
2
V
VIL
Low-level input voltage (DIN1, DIN2)
0.8
V
Receiver input voltage (RIN1, RIN2)
±3
±30
V
TA
Operating free-air temperature
MAX232EC
0
70
°C
MAX232EI
–40
85
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2)
Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(3)
The package thermal impedance is calculated in accordance with JESD 51-7.
6.4 Thermal Information
THERMAL METRIC(1)(2)(3)
MAX232E
UNIT
D
(SOIC)
DW
(SOIC)
N
(PDIP)
PW
(TSSOP)
16 PINS
16 PINS
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
73.8
73.4
43.3
101.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
33.4
35.1
30
29.3
°C/W
RθJB
Junction-to-board thermal resistance
31.4
38.3
23.3
47.3
°C/W


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