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TLP759IGM Arkusz danych(PDF) 2 Page - Toshiba Semiconductor

Numer części TLP759IGM
Szczegółowy opis  Transistor Invertor Inverter For Air Conditioner Line Receiver IPM Interfaces
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Producent  TOSHIBA [Toshiba Semiconductor]
Strona internetowa  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TLP759IGM Arkusz danych(HTML) 2 Page - Toshiba Semiconductor

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TLP759(IGM)
2003-02-19
2
· Option (D4) type
VDE approved: DIN VDE0884 / 06.92,
Maximum operating insulation voltage: 890VPK
Highest permissible over voltage: 6000VPK
(Note 1) When a VDE0884 approved type is needed,
please designate the “Option (D4)”
· Structural parameter
7.62mm pich TLP759 (IGM)
Creepage distance: 7.0mm (min.)
Clearance: 7.0mm (min.)
Insulation thickness: 0.4mm (min.)
Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Forward current
(Note 2)
IF
25
mA
Pulse forward current
(Note 3)
IFP
50
mA
Peak transient forward current
(Note 4)
IFPT
1
A
Reverse voltage
VR
5
V
Diode power dissipation
(Note 5)
PD
45
mW
Output current
IO
8
mA
Peak output current
IOP
16
mA
Output voltage
VO
-0.5~20
V
supply voltage
VCC
-0.5~30
V
Output power dissipation
(Note 6)
PO
100
mW
Operating temperature range
Topr
-55~100
°C
Storage temperature range
Tstg
-55~125
°C
Lead solder temperature(10s)
(Note 7)
Tsol
260
°C
Isolation voltage(AC,1min.,R.H.≤60%,Ta=25°C)
(Note 8)
BVS
5000
Vrms
(Note 2): Derate 0.8mA above 70°C.
(Note 3): 50% duty cycle,1ms pulse width.
Derate 1.6mA / °C above 70°C.
(Note 4): Pulse width PW ≤ 1µs,300pps.
(Note 5): Derate 0.9mW / °C above 70°C.
(Note 6): Derate 2mW / °C above 70°C.
(Note 7): Soldering portion of lead: Up to 2mm from the body of the device.
(Note 8): Device considerd a two terminal device: Pins 1, 2, 3 and 4 shorted together and
pins 5, 6, 7 and 8 shorted together.


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