MC10EP139, MC100EP139

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4

Table 3. ATTRIBUTES

Characteristics

Value

Internal Input Pulldown Resistor

75 kW

Internal Input Pullup Resistor

N/A

ESD Protection

Human Body Model

Machine Model

Charged Device Model

> 2 kV

> 100 V

> 2 kV

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

Pb-Free Pkg

SOIC−20 WB

TSSOP−20 WB

QFN−20

Level 3

Level 1

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

Transistor Count

758 Devices

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Table 4. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Unit

PECL Mode Power Supply

6

V

NECL Mode Power Supply

−6

V

PECL Mode Input Voltage

NECL Mode Input Voltage

6

−6

V

Output Current

Continuous

Surge

50

100

mA

±0.5

mA

Operating Temperature Range

−40 to +85

°C

Storage Temperature Range

−65 to +150

°C

Thermal Resistance (Junction-to-Ambient)

0 lfpm

500 lfpm

TSSOP−20 WB

TSSOP−20 WB

140

100

°C/W

Thermal Resistance (Junction-to-Case)

Standard Board

TSSOP−20 WB

23 to 41

°C/W

Thermal Resistance (Junction-to-Ambient)

0 lfpm

500 lfpm

SOIC−20 WB

SOIC−20 WB

90

60

°C/W

Thermal Resistance (Junction-to-Case)

Standard Board

SOIC−20 WB

33 to 35

°C/W

Thermal Resistance (Junction-to-Ambient)

0 lfpm

500 lfpm

QFN−20

QFN−20

47

33

°C/W

Thermal Resistance (Junction-to-Case)

Standard Board

QFN−20

18

°C/W

Wave Solder (Pb-Free)

< 2 to 3 sec @ 260°C

265

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.