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AD9122SCPZ-EP-RL Arkusz danych(PDF) 8 Page - Analog Devices |
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AD9122SCPZ-EP-RL Arkusz danych(HTML) 8 Page - Analog Devices |
8 / 12 page AD9122-EP Enhanced Product Rev. 0 | Page 8 of 12 ABSOLUTE MAXIMUM RATINGS Table 7. Parameter Rating AVDD33 to AVSS, EPAD, CVSS, DVSS −0.3 V to +3.6 V IOVDD to AVSS, EPAD, CVSS, DVSS −0.3 V to +3.6 V DVDD18, CVDD18 to AVSS, EPAD, CVSS, DVSS −0.3 V to +2.1 V AVSS to EPAD, CVSS, DVSS −0.3 V to +0.3 V EPAD to AVSS, CVSS, DVSS −0.3 V to +0.3 V CVSS to AVSS, EPAD, DVSS −0.3 V to +0.3 V DVSS to AVSS, EPAD, CVSS −0.3 V to +0.3 V FSADJ, REFIO, IOUT1P, IOUT1N, IOUT2P, IOUT2N to AVSS −0.3 V to AVDD33 + 0.3 V D[15:0]P, D[15:0]N, FRAMEP, FRAMEN, DCIP, DCIN to EPAD, DVSS −0.3 V to DVDD18 + 0.3 V DACCLKP, DACCLKN, REFCLKP, REFCLKN to CVSS −0.3 V to CVDD18 + 0.3 V RESET, IRQ, CS, SCLK, SDIO, SDO to EPAD, DVSS −0.3 V to IOVDD + 0.3 V Junction Temperature 125°C Storage Temperature Range −65°C to +150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE The exposed pad (EPAD) of the 72-lead LFCSP must be soldered to the ground plane (AVSS). The EPAD provides an electrical, thermal, and mechanical connection to the board. Typical θJA, θJB, and θJC values are specified for a 4-layer board in still air. Airflow increases heat dissipation, effectively reducing θJA and θJB. Table 8. Thermal Resistance Package θ JA θ JB θ JC Unit Conditions 72-Lead LFCSP 20.7 10.9 1.1 °C/W EPAD soldered to ground plane ESD CAUTION |
Podobny numer części - AD9122SCPZ-EP-RL |
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Podobny opis - AD9122SCPZ-EP-RL |
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