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BU4051BCFV Arkusz danych(PDF) 10 Page - Rohm

Numer części BU4051BCFV
Szczegółowy opis  8ch Analog Multiplexer/Demultiplexer
Download  21 Pages
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Producent  ROHM [Rohm]
Strona internetowa  http://www.rohm.com
Logo ROHM - Rohm

BU4051BCFV Arkusz danych(HTML) 10 Page - Rohm

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TSZ02201-0RDR0GZ00280-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
06.Jan.2015 Rev.001
www.rohm.com
TSZ22111 • 15 • 001
BU4051BC BU4051BCF BU4051BCFV
Power Dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at TA=25°C(normal temperature). IC is
heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable
power is limited. Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and
thermal resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the
maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin
or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is
called thermal resistance, represented by the symbol θJA (°C/W).The temperature of IC inside the package can be
estimated by this thermal resistance. Figure 21 shows the model of thermal resistance of the package. Thermal resistance
θJA, ambient temperature TA, maximum junction temperature TJmax, and power dissipation PD can be calculated by the
equation below:
θJA = (TJmax - TA) / PD
(°C/W)
Derating curve in Figure 22 indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package
condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value
measured at a specified condition.
I/O Equivalent Circuits
Pin No.
Control Input Terminals
Input / Output Terminals
6,9,10,11
1,2,3,4,5,12,13,14,15
Equivalence
Circuit
VDD
VDD
GND
GND
VDD
GND
Figure 22. Derating Curve
Figure 21. Thermal Resistance
周囲温度
Ta [℃]
チップ 表面温度
Tj [℃]
消費電力 P [W]
Ambient temperature TA (℃)
Chip surface temperature TJ(℃)
θJA =( TJmax - TA)/ PD (°C/W)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0
25
50
75
100
125
150
Ambient Temperature [℃]
BU4051BCF (SOP16)
85
BU4051BCFV (SSOP-B16)
BU4051BC (DIP16)
VSS
VEE
VDD
VDD
VDD
VSS


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