SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N1509, Rev. -

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

UA1A-UA1M

UA1A-UA1M

Ultrafast Avalanche Diodes

Features:

•

Ideally Suited for Automatic Assembly

•

Low Forward Overload Drop, High Efficiency

•

Low Power Loss

•

Super-Fast Recovery Time

•

Plastic Material has UL Classification 94V-O

•

This is a Pb − Free Device

•

All SMC parts are traceable to the wafer lot

•

Additional testing can be offered upon request

Mechanical Data:

•

Case: Low Profile Molded Plastic

•

Terminals: Solder Plated, Solderable per MIL-STD-750,

Method 2026

•

Polarity: Cathode Band or Cathode Notch

•

Marking: Type Number

•

Weight: 0.11 grams(approx)

Mechanical Dimensions: In mm(Inches)

SMA

MARKING, MOLDING RESIN

Marking for UA1A/B/C/D/E/G/J/K/M, 1

Where YY is the manufacture year

WW is the manufacture week code

L is the wafer’s Lot Number

SMA/DO-214AC

Dim.

Min.

Max.

Min.

Max.

A

2.18

2.90

0.086

0.114

B

3.99

4.60

0.157

0.181

C

1.29

1.70

0.508

0.067

D

0.152

0.305

0.006

0.012

E

4.70

5.31

0.185

0.209

F

1.70

2.50

0.067

0.098

G

0.051

0.203

0.002

0.008

H

0.76

1.55

0.030

0.610

In mm

In inches

UA1A