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MV-101-27E Arkusz danych(PDF) 1 Page - Ohmite Mfg. Co. |
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MV-101-27E Arkusz danych(HTML) 1 Page - Ohmite Mfg. Co. |
1 / 2 page 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com 177 M Series Heatsinks Heatsink with clips for TO-264 and TO-247 Thermal Surface Area Weight Resistance Part No. (in2/mm2) (oz./g) (°c/w)* MV-102-55E 45 / 29,097 2.2 / 63 6.0 MA-102-55E 45 / 29,097 2.2 / 63 5.2 MV-101-27E 22 / 14,284 1.1 / 31 9.6 MA-101-27E 22 / 14,284 1.1 / 31 8.0 MV-302-55E 76 / 49,218 4.7 / 134 3.6 MA-302-55E 76 / 49,218 4.7 / 134 3.0 MV-301-27E 37.3 / 24,161 2.3 / 66 5.5 MA-301-27E 37.3 / 24,161 2.3 / 66 4.6 * R-thetac-a for 18W dissipation total for two devices in natural convection Fea ture S •Minimumassemblycostandlabor.SpringClips makethemountingholesandfastenersobsoletein assemblyoperations&reducecosts. •MaximumThermalTransfer.Maximumsurfacearea perunitvolume,efficientcoolingfins&consistent mountingforcereducesthermalresistance •MaximumRepeatability.Constantspringforceover repeatedassembly/disassembly •MaximumReliability.Resilientspringactionlocks electroniccomponentinplace.Fewerpartsin assemblyandnofastenersandwashersrequired. Preventshortcircuitbyeliminatingmetalparticles generatedfromhardwareorthreadtapping •DesignFlexibility.Maximumflexibilityfordynamic devicelocationsandpowerupgrading.“Configure- to-Fit”&“Scale-to-Meet”optionsgivedesignersthe totalfreedomtoconfiguretheheatsinktofittheir packagingdesignsandtoscaletheheatsinkto meettheirpowerdissipations. C H ara C teri S ti CS Heat Sink Aluminum Alloy 6063-T5 or Equivalent with either degreased or black anodized finish. Spring Clip Music Wire, Per ASTM A228 with bright nickel plating Solder Foot Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike. RoHS com- pliant. Interface thermal resistance Thermal joint compound or 0.005 Grafoil (TGon 800 by Laird) Interface electrical isolation Sil-Pad 900S by Bergquist or equivalent S erie S S pe C i F i C ation S OhmiteintroducestheMseries,patented(Pat.No. 7,151,669),highperformance,lowcost,configu- rable,scalableandcompactheatsinkwithmatrixclip systemforTO-247andTO-264packages.Thispow- erfulheatsinkprovidestheeasiestassembly,largest surfaceareaandsmallestfootprint.Itistheideal typeofheatsinkforhighpowerdensityandsmall size(1Uor2U)electronicpackagingwithforcedcon- vectioncooling. (continued) |
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