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RX110 Arkusz danych(PDF) 68 Page - Renesas Technology Corp

Numer części RX110
Szczegółowy opis  32 MHz 32-bit RX MCUs, 50 DMIPS
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Producent  RENESAS [Renesas Technology Corp]
Strona internetowa  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

RX110 Arkusz danych(HTML) 68 Page - Renesas Technology Corp

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R01DS0202EJ0120 Rev.1.20
Page 68 of 108
Jul 29, 2016
RX110 Group
5. Electrical Characteristics
5.3.3
Timing of Recovery from Low Power Consumption Modes
Note:
When the division ratios of PCLKB, PCLKD, FCLK, and ICLK are all set to 1.
Note 1. The recovery time varies depending on the state of each oscillator when the WAIT instruction is executed. The recovery time
when multiple oscillators are operating varies depending on the operating state of the oscillators that are not selected as the
system clock source. This applies when only the oscillator listed in each item is operating and the other oscillators are stopped.
Note 2. When the frequency of the crystal is 20 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 04h.
Note 3. When the frequency of the external clock is 20 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 00h.
Note 4. When the frequency of HOCO is 32 MHz.
When the high-speed clock oscillator wait control register (HOCOWTCR) is set to 05h.
Note:
When the division ratios of PCLKB, PCLKD, FCLK, and ICLK are all set to 1.
Note 1. The recovery time varies depending on the state of each oscillator when the WAIT instruction is executed. The recovery time
when multiple oscillators are operating varies depending on the operating state of the oscillators that are not selected as the
system clock source. This applies when only the oscillator listed in each item is operating and the other oscillators are stopped.
Note 2. When the frequency of the crystal is 12 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 04h.
Note 3. When the frequency of the external clock is 12 MHz.
When the main clock oscillator wait control register (MOSCWTCR) is set to 00h.
Note 4. When the frequency of HOCO is 8 MHz.
When the high-speed clock oscillator wait control register (HOCOWTCR) is set to 05h.
Table 5.24
Timing of Recovery from Low Power Consumption Modes (1)
Conditions: 1.8 V
≤ VCC ≤ 3.6 V, 1.8 V ≤ AVCC0 ≤ 3.6 V, VSS = AVSS0 = 0 V, T
a = –40 to +105°C
Item
Symbol
Min.
Typ.
Max.
Unit
Test
Conditions
Recovery time
from software
standby mode*1
High-speed
mode
Crystal
connected to
main clock
oscillator
Main clock oscillator
operating*2
tSBYMC
—2
3
ms
Figure 5.28
External clock
input to main
clock oscillator
Main clock oscillator
operating*3
tSBYEX
—35
50
μs
Sub-clock oscillator operating
tSBYSC
650
800
μs
HOCO clock oscillator operating*4
tSBYHO
—40
55
μs
LOCO clock oscillator operating
tSBYLO
—40
55
μs
Table 5.25
Timing of Recovery from Low Power Consumption Modes (2)
Conditions: 1.8 V
≤ VCC ≤ 3.6 V, 1.8 V ≤ AVCC0 ≤ 3.6 V, VSS = AVSS0 = 0 V, T
a = –40 to +105°C
Item
Symbol
Min.
Typ.
Max.
Unit
Test
Conditions
Recovery time
from software
standby mode*1
Middle-speed
mode
Crystal
connected to
main clock
oscillator
Main clock oscillator
operating*2
tSBYMC
—2
3
ms
Figure 5.28
External clock
input to main
clock oscillator
Main clock oscillator
operating*3
tSBYEX
—3
4
μs
Sub-clock oscillator operating
tSBYSC
600
750
μs
HOCO clock oscillator operating*4
tSBYHO
—40
50
μs
LOCO clock oscillator operating
tSBYLO
—4.8
7
μs


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